| PART |
Description |
Maker |
| DB2460200L |
Embossed type (Thermo-compression sealing) : 3 000 pcs / reel (standard)
|
Panasonic Semiconductor
|
| DB2230400L |
Embossed type (Thermo-compression sealing) : 3 000 pcs / reel (standard)
|
Panasonic Battery Group
|
| DB2460500L |
Embossed type (Thermo-compression sealing) : 3 000 pcs / reel (standard)
|
Panasonic Semiconductor
|
| 0674901231 67490-1231 |
1.27mm (.050) Pitch Serial ATA Header, Standard Type, Surface Mount, Right Angle,7 Circuits, with Mylar, 0.76μm (30μ) Gold (Au) Plating, Embossed Tape on ReelPackage, Lead-free
|
Molex Electronics Ltd.
|
| BM03B-ZESS-TBTLFSN |
ZE CONNECTOR EMBOSSED-TAPING
|
Lightel Technologies INC.
|
| 502494-1270 502494-1370 502494-0470 502494-0870 50 |
EMBOSSED TAPE PACKAGE FOR 502494
|
Molex Electronics Ltd.
|
| GRM32ER61C226ME20L GRM32ER61C226ME20K |
φ180, 330mm Embossed taping
|
Murata Manufacturing Co., Ltd.
|
| LMK212ABJ106KGHT |
Standard packaging quantity (minimum) Taping Embossed 3000pcs
|
Taiyo Yuden (U.S.A.), I...
|
| HMK316AC7225ML-TE |
Standard packaging quantity (minimum) Taping Embossed 2000pcs
|
Taiyo Yuden (U.S.A.), I...
|
| 67492-1631 0674921631 |
1.27mm (.050") Pitch Serial ATA Host Receptacle, Right Angle, SMT, Mating Height 4.45mm (.175"), 0.76渭m (30渭") Gold (Au) Plating, with Cap,Embossed Tape on Reel
1.27mm (.050) Pitch Serial ATA Host Receptacle, Right Angle, SMT, Mating Height 4.45mm (.175), 0.76μm (30μ) Gold (Au) Plating, with Cap,Embossed Tape on ReelPackaging,22 Circuits, Lead Free
|
Molex Electronics Ltd.
|
| 67492-1820 |
1.27mm (.050") Pitch Serial ATA Host Receptacle, Right Angle, SMT, Mating Height5.60mm (.220"), Gold (Au) Flash, without Cap, Embossed Tape on Reel Packaging, 2
1.27mm (.050) Pitch Serial ATA Host Receptacle, Right Angle, SMT, Mating Height5.60mm (.220), Gold (Au) Flash, without Cap, Embossed Tape on Reel Packaging, 22Circuits, Lead Free
|
Molex Electronics Ltd.
|
|
