| PART |
Description |
Maker |
| 0479890232 47989-0232 |
1.00mm (.039) by 1.00mm (.039) Pitch rPGA 988A Notebook PC CPU Socket,with Pick-and-Place Cover, Hard Tray Packaging, 988 Circuits, Lead free
|
Molex Electronics Ltd.
|
| 87914-3616 0879143616 |
2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, 36 Circuits, 2.50μm (98.4μ) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole, Dual Row, Vertical, 36 Circuits, 2.50渭m (98.4渭) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
2.54mm (.100) Pitch C-Grid垄莽 Header, Through Hole, Dual Row, Vertical, 36 Circuits, 2.50楼矛m (98.4楼矛) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
|
Molex Electronics Ltd.
|
| 87914-2216 0879142216 |
2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, 22 Circuits, 2.50μm (98.4μ) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole, Dual Row, Vertical, 22 Circuits, 2.50渭m (98.4渭) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
2.54mm (.100) Pitch C-Grid垄莽 Header, Through Hole, Dual Row, Vertical, 22 Circuits, 2.50楼矛m (98.4楼矛) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
|
Molex Electronics Ltd.
|
| 1-2013297-5 1-2013297-6 |
Memory Sockets; SEMI-HARD TRAY DDR3 204P 8H STD B-L 0.76 ( Tyco Electronics )
Memory Sockets; SEMI-HARD TRAY DDR3 204P 8H STD B-L 0.25 ( Tyco Electronics )
|
Tyco Electronics
|
| 87891-0606 |
2.54mm (.100) Pitch KK庐 Header, Through Hole, Breakaway, Vertical, 6 Circuits, 2.50渭m (100渭) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
2.54mm (.100) Pitch KK? Header, Through Hole, Breakaway, Vertical, 6 Circuits, 2.50μm (100μ) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
|
Molex Electronics Ltd.
|
| 87891-4006 |
2.54mm (.100) Pitch KK庐 Header, Through Hole, Breakaway, Vertical, 40 Circuits, 2.50渭m (100渭) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
2.54mm (.100) Pitch KK? Header, Through Hole, Breakaway, Vertical, 40 Circuits, 2.50μm (100μ) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
|
Molex Electronics Ltd.
|
| 87914-1816 |
2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, 18 Circuits, 2.50μm (98.4μ) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
2.54mm (.100) Pitch C-Grid垄莽 Header, Through Hole, Dual Row, Vertical, 18 Circuits, 2.50楼矛m (98.4楼矛) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
|
Molex Electronics Ltd.
|
| 0877580817 87758-0817 |
2.00mm (.079) Pitch Milli-Grid?/a> Header, Through Hole, Vertical, 8 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free
2.00mm (.079") Pitch Milli-Grid垄芒 Header, Through Hole, Vertical, 8 Circuits, 0.76楼矛m (30楼矛") Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free
|
Molex Electronics Ltd.
|
| 0879145016 87914-5016 |
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole, Dual Row, Vertical, 50 Circuits, 2.50渭m (98.4渭) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, 50 Circuits, 2.50μm (98.4μ) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
|
Molex Electronics Ltd.
|
| PS-55JD1-012M1 PS-55JD1-015M1 PS-55JD1-005M1 PS-55 |
Hi-Rel DC-DC Standard Single Converter in a ATR package; A ATR2812S with Standard Packaging
Hi-Rel RAD-Hard, Dual, 28V Input DC-DC Converter in LS package; Hi-Rel RAD-Hard, Dual, 28V Input DC-DC Converter in LS package
Hi-Rel DC-DC Standard Triple Converter in a ATO package; A ATO2812T with Standard Packaging
Analog IC 模拟IC
|
Electronic Theatre Controls, Inc.
|
| 0674921422 67492-1422 |
1.27mm (.050") Pitch Serial ATA Host Receptacle, Right Angle, SMT, Mating Height5.90mm (.232"), 0.38渭m (15渭") Gold (Au) Plating, Tray Packaging, 22 Circuits, Le
1.27mm (.050) Pitch Serial ATA Host Receptacle, Right Angle, SMT, Mating Height5.90mm (.232), 0.38μm (15μ) Gold (Au) Plating, Tray Packaging, 22 Circuits, LeadFree
|
Molex Electronics Ltd.
|
|
