| PART |
Description |
Maker |
| UPD23C1010AC |
x8 ROM (Mask Programmable)
|
|
| HN62331AP HN62331F |
CMOS MASK Programmable ROM
|
Hitachi
|
| LH534700 |
CMOS 4M Mask-Programmable ROM
|
Sharp
|
| UM23C1024 |
CMOS Mask Programmable ROM
|
UMC
|
| UPD23C1010A |
Mask Programmable CMOS ROM
|
NEC Electronics
|
| MX23C8000 MX23C8000MC-10 MX23C8000MC-12 MX23C8000M |
8M-BIT [1M x 8] CMOS MASK ROM 1M X 8 MASK PROM, 150 ns, PDIP32
8M-BIT [1M x 8] CMOS MASK ROM 1M X 8 MASK PROM, 120 ns, PDIP32
8M-BIT [1M x 8] CMOS MASK ROM 1M X 8 MASK PROM, 200 ns, PQCC32
8M-BIT [1M x 8] CMOS MASK ROM 1M X 8 MASK PROM, 100 ns, PQCC32
8M-BIT [1M x 8] CMOS MASK ROM 1M X 8 MASK PROM, 120 ns, PQCC32
|
Macronix International Co., Ltd.
|
| LH5324P00A |
CMOS 24M (3M x 8/1.5M x 16) Mask-Programmable ROM
|
Sharp Electrionic Components
|
| AM27X010-255EC AM27X010-70EI AM27X010-70EC |
x8 ROM (Mask Programmable) x8光盘（掩模可编程
|
Storm Interface
|
| LH5324P00A LH5324P00AN |
CMOS 24M(1,5M X 16) Mask-Programmable ROM
CMOS 24M (3M x 8/1.5M x 16) Mask-Programmable ROM
|
Sharp Corporation
|
| AM27X100-300PC AM27X100-150XC AM27X100-150PC AM27X |
x8 ROM (Mask Programmable) x8光盘（掩模可编程
|
TE Connectivity, Ltd.
Advanced Micro Devices, Inc.
NXP Semiconductors N.V.
|
| GM23C8000-20 GM23C8000FW-20 |
x8 ROM (Mask Programmable) x8光盘（掩模可编程
|
TE Connectivity, Ltd.
Harwin PLC
|
