PART |
Description |
Maker |
IT3D-300S-BGA TR0636E-20027 |
IT3D(M)-300S-BGA (57) BGA Shearing Force TEST REPORT
|
Hirose Electric
|
CXK77P36E160GB-43BE CXK77P18E160GB-4BE CXK77P18E16 |
1M X 18 STANDARD SRAM, 3.7 ns, PBGA119 14 X 22 MM, 1.27 MM PITCH, BGA-119 1M X 18 STANDARD SRAM, 4.5 ns, PBGA119 14 X 22 MM, 1.27 MM PITCH, BGA-119 1M X 18 STANDARD SRAM, 3.8 ns, PBGA119 14 X 22 MM, 1.27 MM PITCH, BGA-119 1M X 18 STANDARD SRAM, 4.1 ns, PBGA119 14 X 22 MM, 1.27 MM PITCH, BGA-119 16Mb LW R-L HSTL High Speed Synchronous SRAMs (512K x 36 or 1M x 18) 16Mb的龙运RL HSTL高速同步静态存储器(为512k × 3600万18 CAP 820PF 50V 20% X7R SMD-0603 TR-7 PLATED-NI/SN
|
http:// Yuasa Battery, Inc. Integrated Circuit Technology Corp Microsemi, Corp. Sony, Corp. Sony Corporation
|
HYRDU64164M-80M HYRDU72184M-80M HYRDU72184M-60M |
4M X 16 RAMBUS, PBGA66 MICRO, BGA-66 4M X 18 RAMBUS, PBGA74 MICRO, BGA-74
|
Hynix Semiconductor, Inc.
|
IBM25PPC740L-GB300A2R IBM25PPC740L-GB350A2R IBM25P |
32-BIT, 300 MHz, RISC PROCESSOR, CBGA255 21 X 21 MM, 1.27 MM PITCH, CERAMIC, BGA-255 32-BIT, 350 MHz, RISC PROCESSOR, CBGA255 21 X 21 MM, 1.27 MM PITCH, CERAMIC, BGA-255 32-BIT, 375 MHz, RISC PROCESSOR, CBGA255 21 X 21 MM, 1.27 MM PITCH, CERAMIC, BGA-255 32-BIT, 400 MHz, RISC PROCESSOR, CBGA255 21 X 21 MM, 1.27 MM PITCH, CERAMIC, BGA-255 32-BIT, 333 MHz, RISC PROCESSOR, CBGA255 21 X 21 MM, 1.27 MM PITCH, CERAMIC, BGA-255 32-BIT, 366 MHz, RISC PROCESSOR, CBGA360
|
Electronic Theatre Controls, Inc.
|
1MGS548-673GG 1MGS548-636GG 1FGS548-636GG 1FGS548- |
BGA548, IC SOCKET 387 POS 1.27MM BGA SOCKET BGA387, IC SOCKET 500 POS 1.27MM BGA EXT. SOCKET BGA500, IC SOCKET BGA476, IC SOCKET BGA731, IC SOCKET BGA736, IC SOCKET BGA72, IC SOCKET BGA240, IC SOCKET BGA404, IC SOCKET BGA516, IC SOCKET BGA400, IC SOCKET BGA169, IC SOCKET BGA168, IC SOCKET BGA409, IC SOCKET BGA160, IC SOCKET BGA1036, IC SOCKET BGA672, IC SOCKET BGA665, IC SOCKET BGA361, IC SOCKET BGA553, IC SOCKET BGA353, IC SOCKET BGA315, IC SOCKET BGA496, IC SOCKET BGA49, IC SOCKET BGA493, IC SOCKET 316 POS 1.27MM BGA EXT. SOCKET BGA618, IC SOCKET BGA108, IC SOCKET BGA121, IC SOCKET BGA292, IC SOCKET BGA120, IC SOCKET BGA1284, IC SOCKET BGA84, IC SOCKET BGA838, IC SOCKET BGA144, IC SOCKET BGA648, IC SOCKET BGA1152, IC SOCKET BGA503, IC SOCKET BGA580, IC SOCKET BGA824, IC SOCKET BGA324, IC SOCKET BGA225, IC SOCKET BGA385, IC SOCKET BGA615, IC SOCKET BGA384, IC SOCKET BGA153, IC SOCKET BGA528, IC SOCKET BGA233, IC SOCKET BGA1225, IC SOCKET BGA673, IC SOCKET BGA256, IC SOCKET
|
Advanced Interconnections, Corp. ADVANCED INTERCONNECTIONS CORP
|
IBM25PPC740L-GB375A2T IBM25PPC740L-GB375A2R IBM25P |
MICROPROCESSOR|32-BIT|CMOS|BGA|360PIN|CERAMIC MICROPROCESSOR|32-BIT|CMOS|BGA|255PIN|CERAMIC 微处理器| 32位|的CMOS | BGA封装| 255PIN |陶瓷
|
Glenair, Inc. Vishay Semiconductors
|
TSC51C2XXX-12IB TSC51C2XXX-16IB TSC51C2XXX-A12IB T |
IC MAX 7000 CPLD 512 208-PQFP IC MAX IIZ CPLD 570 LE 256-MBGA IC MAX 7000 CPLD 512 256-FBGA 484-pin FineLine BGA RoHS Compliant: Yes 956-pin BGA RoHS Compliant: Yes IC,FPGA,32470-CELL,CMOS,BGA,1020PIN,PLASTIC FPGA Logic IC Logic Type:FPGA; No. of Macrocells:726; Package/Case:1020-BGA; Leaded Process Compatible:No; Number of Circuits:32; IC,FPGA,4800-CELL,CMOS,BGA,484PIN,PLASTIC IC,FPGA,10570-CELL,CMOS,BGA,672PIN,PLASTIC IC,FPGA,14400-CELL,CMOS,BGA,780PIN,PLASTIC No. of Macrocells:192; No. of Pins:68; Operating Temp. Max:85°C; Operating Temp. Min:0°C; Propagation Delay:7.5ns RoHS Compliant: Yes; No. of Macrocells:192; No. of Pins:100; Operating Temp. Max:85°C; Operating Temp. Min:0°C; Propagation Delay:7.5ns RoHS Compliant: Yes; No. of Macrocells:160; No. of Pins:84; Operating Temp. Max:70 C; Operating Temp. Min:0 C; Propagation Delay:10ns RoHS Compliant: Yes; No. of Macrocells:440; No. of Pins:100; Operating Temp. Max:85°C; Operating Temp. Min:0°C; Propagation Delay:9ns RoHS Compliant: Yes; 8-BIT MICROCONTROLLER 8位微控制 IC MAX 7000 CPLD 128 100-PQFP 8位微控制 IC MAX 7000 CPLD 160 84-PLCC 8位微控制
|
TE Connectivity, Ltd. Diodes, Inc. Semtech, Corp.
|
GWIXP455AAC EWIXP455AACT EWIXP465AAC EWIXP465AAD E |
400 MHz, RISC PROCESSOR, PBGA544 PLASTIC, BGA-544 400 MHz, RISC PROCESSOR, PBGA544 ROHS COMPLIANT, PLASTIC, BGA-544 533 MHz, RISC PROCESSOR, PBGA544 ROHS COMPLIANT, PLASTIC, BGA-544 266 MHz, RISC PROCESSOR, PBGA544 ROHS COMPLIANT, PLASTIC, BGA-544 266 MHz, RISC PROCESSOR, PBGA544 PLASTIC, BGA-544 667 MHz, RISC PROCESSOR, PBGA544 ROHS COMPLIANT, PLASTIC, BGA-544 533 MHz, RISC PROCESSOR, PBGA544 PLASTIC, BGA-544
|
Intel, Corp. INTEL CORP
|
EPM7512AEBC256-10 EPM7256AEFC100-10 |
COMPLEX-EEPLD,512-CELL,10NS PROP DELAY,BGA,256PIN,PLASTIC COMPLEX-EEPLD,256-CELL,10NS PROP DELAY,BGA,100PIN,PLASTIC
|
Altera Corp
|
N01L1618N1AB2-70I N01L1618N1AB-70I |
64K X 16 STANDARD SRAM, 70 ns, PBGA48 GREEN, BGA-48 64K X 16 STANDARD SRAM, 70 ns, PBGA48 BGA-48
|
ON Semiconductor ST Microelectronics
|
K7P401823B-HC650 K7P401823B-HC750 K7P403623B |
256K X 18 STANDARD SRAM, 6.5 ns, PBGA119 14 X 22 MM, BGA-119 256K X 18 STANDARD SRAM, 7.5 ns, PBGA119 14 X 22 MM, BGA-119 128Kx36 & 256Kx18 SRAM
|
Samsung semiconductor
|
M5LV-512/256-10SAI M5LV-512/256-12SAC M5LV-256/160 |
EE PLD, 10 ns, PBGA352 BGA-352 EE PLD, 12 ns, PBGA352 BGA-352 Fifth Generation MACH Architecture EE PLD, 10 ns, PQFP208 Fifth Generation MACH Architecture EE PLD, 12 ns, PQFP208 Fifth Generation MACH Architecture EE PLD, 20 ns, PQFP160 Fifth Generation MACH Architecture EE PLD, 5.5 ns, PQFP100 Fifth Generation MACH Architecture EE PLD, 15 ns, PQFP160 Fifth Generation MACH Architecture EE PLD, 10 ns, PQFP160 EE PLD, 15 ns, PBGA352 BGA-352 Fifth Generation MACH Architecture EE PLD, 5.5 ns, PQFP144 EE PLD, 15 ns, PQFP160 PLASTIC, QFP-160 CONNECTOR ACCESSORY EE PLD, 5.5 ns, PQFP100 Fifth Generation MACH Architecture EE PLD, 15 ns, PQFP208 Fifth Generation MACH Architecture EE PLD, 7.5 ns, PQFP208 Fifth Generation MACH Architecture EE PLD, 10 ns, PQFP100 EE PLD, 15 ns, PQFP100 TQFP-100 Fifth Generation MACH Architecture EE PLD, 20 ns, PQFP208 EE PLD, 12 ns, PQFP100 TQFP-100 EE PLD, 12 ns, PBGA256 BGA-256
|
Lattice Semiconductor, Corp. LATTICE SEMICONDUCTOR CORP
|
|