| PART |
Description |
Maker |
| J68.APACKAGE |
68 PAD CERAMIC LEADLESS CHIP CARRIER PACKAGE
|
Intersil Corporation
|
| ILCX10-FF1318-20.000 ILCX10-FF1F18-20.000 ILCX10-F |
2 Pad Ceramic Package Quartz Crystal, 5 mm x 7 mm
2 Pad Ceramic Package Quartz Crystal, 5 mm x 7 mm
|
ILSI America LLC
|
| ILCX19-JF0F18-20.000 ILCX19-JF1F18-20.000 ILCX19-J |
4 Pad Ceramic Package Quartz Crystal, 1.6 mm x 2 mm
4 Pad Ceramic Package Quartz Crystal, 1.6 mm x 2 mm
|
ILSI America LLC
|
| ACT753SMX-4 |
4 pad, high quality, low aging SMD Crystal in a ceramic base
|
Advanced Crystal Technology
|
| 21-0109B |
PACKAGE OUTLINE, 10L uMAX, EXPOSED PAD
|
Maxim Integrated Products, Inc.
MAXIM - Dallas Semiconductor
|
| P1BR |
For suggested pad layout, see drawing: PAD-01
|
All Sensors Corporation
|
| P2NR |
For suggested pad layout, see drawing: PAD-01
|
All Sensors Corporation
|
| ACT320SMX-4 |
low cost, 4 pad, high quality, low aging 3X2.5mm SMD Crystal in a ceramic base
|
Advanced Crystal Technology
|
| ACT320SMX-412 |
low cost, 4 pad, high quality, low aging 3X2.5mm SMD Crystal in a ceramic base
|
Advanced Crystal Technology
|
| SOT545-3 |
plastic thermal enganced thin quad flat package; 48 leads; body 7 x 7 x 1 mm; exposed die pad
|
NXP Semiconductors
PHILIPS[Philips Semiconductors]
|
| AWSCR-13.01MHZCV-C20-T |
CERAMIC RESONATOR, 13.01 MHz ROHS COMPLIANT, CERAMIC PACKAGE-3
|
Abracon, Corp.
|
