| PART |
Description |
Maker |
| TC2996D |
2.45 GHz 12 W Flange Ceramic Packaged GaAs Power FETs
|
Transcom, Inc.
|
| TC2182 |
Low Noise Ceramic Packaged PHEMT GaAs FETs
|
Transcom, Inc.
|
| TC2997G |
3.5 GHz 16WFlange Ceramic Packaged GaAs Power FETs
|
Transcom, Inc.
|
| QESM052 |
SMD 5.0x3.2 Crystal - Ceramic SMD 2 pads packaged 贴片5.0x3.2水晶-陶瓷贴片2垫包
|
Rakon France SAS
|
| TGA8658-EPU-SG |
Packaged Ku-band HPA
Ku Band 2W Packaged Amplifier
|
TRIQUINT[TriQuint Semiconductor]
|
| QESM07 QESM07120JO2010FREQ3 |
QUARTZ CRYSTAL RESONATOR, 26 MHz - 54 MHz
SMD 3.2x2.5 Crystal -Ceramic SMD packaged
|
TEMEX COMPONENTS
|
| AM2964B/BQA AM2964B/BUA AM2964BPC AM2964BDMB AM296 |
3 Phase Driver, Inverting Input, 0.8us Deadtime in a 28-pin DIP package; A IR2132 packaged in a 28-Lead SOIC shipped on Tape and Reel
3 Phase Driver, Inverting Input, 2.5us Deadtime in a 28-pin DIP package; A IR2130 packaged in a 28-Lead PDIP
Half Bridge Driver, Soft Turn-On, Separate High and Low Side Inputs, Fixed 500ns Deadtime in a 8-pin DIP package; A IR2108 packaged in a 8-Lead PDIP DRAM控制
3 Phase Driver, Inverting Input, 2.5us Deadtime in a 28-pin DIP package; A IR2130 packaged in a Lead-Free 28-Lead SOIC DRAM控制
Half Bridge Driver, SoftTurn-On, Noninverting Inputs in a 8-pin DIP package; A IR2304 packaged in a 8-Lead SOIC DRAM控制
|
NXP Semiconductors N.V.
|
| AM2971ALCB AM2971ALE AM2971DE AM2971DC AM2971A/BJA |
High and Low Side Driver, Shutdown Input in a 14-pin DIP package; A IR2112 packaged in a Lead-Free 16-Lead SOIC
User Programmable Special Function ASIC
High and Low Side Driver, Shutdown Input in a 14-pin DIP package; A IR2112 packaged in a 16-Lead SOIC
High and Low Side Driver, Shutdown Input in a 14-pin DIP package; A IR2112 packaged in a Lead-Free 14-Lead PDIP
High and Low Side Driver, Shutdown Input in a 14-pin DIP package; A IR2112 packaged in a 14-Lead PDIP
High and Low Side Driver, All High Voltage Pins On One Side, Separate Logic and Power Ground, Shut-Down in a 14-pin DIP package; A IR2110 packaged in a Lead-Free 16-Lead PDIP -2 Lead
High and Low Side Driver, All High Voltage Pins On One Side, Separate Logic and Power Ground, Shut-Down in a 14-pin DIP package; A IR2110 packaged in a 14-Lead PDIP
Half Bridge Driver, Soft Turn-On, All High Voltage Pins on One Side, Separate High and Low Side Inputs, Programmable 0.5-5us Deadtime in a 14-pin DIP package; A IR21084 packaged in a Lead-Free 14-Lead SOIC
3 Phase Driver, Separate High and Low Side Inputs, 200ns Deadtime in a 28-pin DIP package; A IR2135 packaged in a Lead-Free mod. 44-Lead PLCC
用户可编ASIC的特殊功
3 Phase Driver, Separate High and Low Side Inputs, 200ns Deadtime in a 28-pin DIP package; A IR2135 packaged in a 28-Lead SOIC 用户可编程ASIC的特殊功
|
Amphenol, Corp.
|
| AS179-92LF AS197-306 |
APN2015:GaAs FETs as Control Devices|DC-6 GHz Plastic Packaged and Chip|SPST
AS197-306:PHEMT GaAs IC High Power SP2T and SP3T S|DC-6 GHz Plastic Packaged and Chip|SPST AS197 - 306：PHEMT的砷化镓集成电路高功率SP2T和SP3T秒|的DC - 6GHz的塑料包装和芯片|聚苯乙烯
|
Amphenol, Corp.
|
| PB-CMM0511-QT-0000 CMM0511-QT-0G0T CMM0511-QT-0G00 |
5.0-14.0 GHz GaAs MMIC Packaged Driver Amplifier 5.0-14.0 GHz的砷化镓微波单片集成电路封装驱动放大
5.0-14.0 GHz GaAs MMIC Packaged Driver Amplifier 5000 MHz - 14000 MHz RF/MICROWAVE WIDE BAND LOW POWER AMPLIFIER
|
Mimix Broadband, Inc.
ATM Electronic, Corp.
|
| KV1913A KV1933A KV1973A KV2143 KV2153 GC1303 KV212 |
ENHANCED PERFORMANCE SURFACE MOUNT EPSM PACKAGED DEVICES
ENHANCED PERFORMANCE SURFACE MOUNT EPSM PACKAGED DEVICES C BAND, SILICON, HYPERABRUPT VARIABLE CAPACITANCE DIODE
ENHANCED PERFORMANCE SURFACE MOUNT EPSM PACKAGED DEVICES C BAND, 1.8 pF, SILICON, ABRUPT VARIABLE CAPACITANCE DIODE
OPTOCOUPLER 10MBPS OC 5-SOP
Tuning Varactors
|
Microsemi, Corp.
MICROSEMI[Microsemi Corporation]
|
| PD25 PD26 PD24 PS56 PS85 PS88 PS58 PS87 PS560 PS58 |
3 Phase Driver, Soft Turn-on, Inverting Input Separate High and Low Side Inputs, 200ns Deadtime.; A IR21363 packaged in a Lead-Free 28-Lead PDIP
3 Phase Driver, Separate High and Low Side Inputs, 200ns Deadtime in a 28-pin DIP package; A IR2135 packaged in a Lead-Free 28-Lead SOIC
High and Low Side Driver, All High Voltage Pins On One Side, Separate Logic and Power Ground, Shut-Down in a 14-pin DIP package; A IR2110 packaged
Half Bridge Driver, SoftTurn-On, Low Side Inverting Input, Separate High and Low Side Input, 500ns Deadtime in a 8-pin DIP package; A IR2183 packaged
3 Phase Driver, Soft Turn-on, Inverting Input Separate High and Low Side Inputs, 200ns Deadtime.; A IR21363 packaged in a Lead-Free 28-Lead SOIC
3 Phase Driver, Soft Turn-on, Inverting Input Separate High and Low Side Inputs, 200ns Deadtime.; A IR21367 packaged in a 28-Lead PDIP
Half Bridge Driver, Soft Turn-On, Single Input Plus Shut-Down, Fixed 500ns Deadtime in a 8-pin DIP package; A IR2109 packaged in a Lead-Free 8-Lead
Single High Side Driver, Noninverting Input in a 8-pin DIP package; A IR2117 packaged in a 8-Lead SOIC
High and Low Side Driver in a 14-pin DIP package; A IR2010 packaged in a Lead-Free 16-Lead SOIC
Half Bridge Driver, Soft Turn-On, Single Input Plus Shut-Down, Fixed 500ns Deadtime in a 8-pin DIP package; A IR2109 packaged in a 8-Lead SOIC
and Power Ground, Programmable Deadtime in a 14-pin DIP package; A IR21834 packaged in a 14-Lead PDIP
Single High Side Driver, Noninverting Input in a 8-pin DIP package; A IR2117 packaged in a 8-Lead PDIP
High voltage, high speed power MOSFET and IGBT driver with three independent high side and low side referenced output channels and with DC Bus
Single High Side Driver, Noninverting Inputs, Current Sensing, Overcurent Detection and Shutdown Fault Output in a 8-pin DIP package; A IR2127
Analog IC 模拟IC
3 Phase Driver, Separate High and Low Side Inputs, 200ns Deadtime in a 28-pin DIP package; A IR2135 packaged in a 28-Lead SOIC shipped on Tape and Reel 模拟IC
High and Low Side Driver, All High Voltage Pins On One Side, Separate Logic and Power Ground, Shut-Down in a 14-pin DIP package; A IR2110 packaged in a 16-Lead SOIC shipped on Tape and Reel
|
Lattice Semiconductor, Corp.
|
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