| PART |
Description |
Maker |
| UDZSTE-175.6B |
Compact, 2-pin mini-mold type for high-density mounting. (UMD2)
|
Rohm
|
| ED2-9T ED2-9TNJ ED2-9TNU ED2-4.5S ED2-4.5SNJ ED2-4 |
Ultra-low power, compact and lightweight, High breakdown voltage, Surface mounting type
|
NEC
|
| HSM88AS |
MPAK package is suitable for high density surface mounting and high speed assembly
|
TY Semiconductor Co., Ltd
|
| HSM107S |
MPAK package is suitable for high density surface mounting and high speed assembly.
|
TY Semiconductor Co., Ltd
|
| HSM88ASR |
MPAK package is suitable for high density surface mounting and high speed assembly
|
TY Semiconductor Co., Ltd
|
| HSB88WA |
CMPAK package is suitable for high density surface mounting and high speed assembly
|
TY Semiconductor Co., Ltd
|
| KD2004-DG10A |
Compact high speed thick film thermal printhead (8dots / mm)
|
Rohm
|
| PC410 |
Compact, Surface Mount Ultra-high Speed Response OPIC Photocoupler
|
Sharp Electrionic Components
|
| EB2 |
COMPACT AND LIGHT WEIGHT SURFACE MOUNTING TYPE
|
NEC Corp.
|
| UB2-3SNU-R UB2-3NUN-R UB2-3SNU UA2-3NJ UA2-3NJ-R U |
Super-compact size, Slim-package, Surface mounting type
Super-compact size/ Slim-package/ Surface mounting type
Super-compact size Slim-package Surface mounting type
|
NEC Corp.
NEC[NEC]
|
| SIL855160 |
AC Semiconductor Contactor pitch 22,5mm compact size and DIN rail mounting.
|
celduc-relais
|
