| PART |
Description |
Maker |
| G6B-1174C-US G6B-1174CUS12VDC G6B-1174CUS24VDC G6B |
Soft-Start Modules; 240 Vac; .04-10 Amp; AC Output
IC,Normally-Open Panel-Mount Solid-State Relay,1-CHANNEL,M:HL048HD4.4
Tantalum Molded Capacitor; Capacitance: 3.3uF; Voltage: 20V; Case Size: 3.2x1.6 mm; Packaging: Tape & Reel
Tantalum Molded Capacitor; Capacitance: 4.7uF; Voltage: 20V; Case Size: 3.2x1.6 mm; Packaging: Tape & Reel
RESISTOR,1%,6.04K OHM,MTL FILM
RELAY SOFTSTART 25A 120VAC ACOUT
Analog Input Power Controller
Tantalum Molded Capacitor; Capacitance: 22uF; Voltage: 20V; Case Size: 5.8x3.1 mm; Packaging: Tape & Reel 超小型继电器，开关多
Tantalum Molded Capacitor; Capacitance: 33uF; Voltage: 20V; Case Size: 7.3x2.8 mm; Packaging: Tape & Reel 超小型继电器，开关多
FILTER, SSR 3 PHASE 超小型继电器，开关多
Sub-miniature Relay that Switches up to 5 A 超小型继电器，开关多5
|
Omron
http://
List of Unclassifed Manufacturers
ETC[ETC]
Electronic Theatre Controls, Inc.
List of Unclassifed Man...
|
| G61XS G61XS-000 G618S G619S G611S |
MULTI-ELEMENT LED LIGHT SOURCE
T-1, (3-mm) Round, PCB Mount Direct View Array, G61XS Series
Tantalum Molded Capacitor; Capacitance: 100uF; Voltage: 4V; Case Size: 3.2x1.6 mm; Packaging: Tape & Reel
Tantalum Molded Capacitor; Capacitance: 330uF; Voltage: 4V; Case Size: 6x3.2 mm; Packaging: Tape & Reel
|
List of Unclassifed Manufacturers
Instrument Design Engineering Associates
ETC[ETC]
Electronic Theatre Controls, Inc.
|
| 0878580250 87858-0250 |
2.00mm (.079) Pitch Milli-Grid Breakaway Header, Surface Mount, Single Row, Vertical, without Peg, with Kapton Tape, Tape on Reel Packaging
|
Molex Electronics Ltd.
|
| KAB02D100M-TLGP KAB04D100M-TLGP KAB03D100M-TLGP KA |
Tantalum Conformal-Coated Capacitor; Capacitance: 22uF; Voltage: 10V; Packaging: Tape & Reel
Multi-Chip Package MEMORY
CONNECTOR ACCESSORY
Tantalum Conformal-Coated Capacitor; Capacitance: 22uF; Voltage: 10V; Packaging: Tape & Reel
SPECIALTY MEMORY CIRCUIT, PBGA80
|
SAMSUNG SEMICONDUCTOR CO. LTD.
|
| MAAD-007082-0001TR |
Tape and Reel Packaging Available
|
M/A-COM Technology Solu...
|
| N111252 |
PACKAGING: TAPE AND REEL/ 4000 PIECES PER
|
E-SWITCH
|
| WAN-0165 |
Safe Handling and Packaging of Tape and Reel Product to be Returned
|
Wolfson Microelectronics plc
|
| 68715014022 |
0.5MM ZIF FPC HORIZONTAL TOP CONTACT TYPE -TAPE & REEL PACKAGING
|
Wurth Elektronik GmbH & Co. KG, Germany.
|
| KA8513B/C KA8513B KA8513C |
FM IF RECEIVER
Tantalum Conformal-Coated Capacitor; Capacitance: 2.2uF; Voltage: 16V; Case Size: 1.4x2.6 mm; Packaging: Tape & Reel 引言
Tantalum Conformal-Coated Capacitor; Capacitance: 2.2uF; Voltage: 16V; Case Size: 1.4x2.6 mm; Packaging: Tape & Reel
|
Samsung Electronic
Samsung Semiconductor Co., Ltd.
SAMSUNG SEMICONDUCTOR CO. LTD.
|
| AM29L510PCB AM29L510/BXC AM29510LMB AM29L510DCB |
and flexible way to implement power solutions for the latest high performance CPUs and ASICs.; Same as IR3086AM with Tape and Reel Packaging
Hi-Rel RAD-Hard, Single, 28V Input DC-DC Converter in LS package; Hi-Rel RAD-Hard, Single, 28V Input DC-DC Converter in LS package
Universal Active ORing Controller. Controller / driver IC in an SO-8 package for implementation of Active ORing / reverse polarity protection using N-channel Power MOSFETs.; Similar to IR5001S with Lead-Free packaging.
200V Secondary Side High Speed SR Controller in a 8-Lead SOIC Package. Used to drive N-Channel power MOSFETs used as Synchronous Rectifiers in isolated Flyback converters.; Similar to IR1166SPBF with Tape and Reel Packaging. 乘法累加
|
ITT, Corp.
|
| 0878980554 87898-0554 |
2.54mm (.100) Pitch KK? Header, Surface Mount, Breakaway, Vertical, 5 Circuits, 0.38μm (15μ) Gold (Au) Plating, Tape on Reel Packaging, with Cap, Lead-free
2.54mm (.100) Pitch KK垄莽 Header, Surface Mount, Breakaway, Vertical, 5 Circuits, 0.38楼矛m (15楼矛) Gold (Au) Plating, Tape on Reel Packaging, with Cap, Lead-free
|
Molex Electronics Ltd.
|
| AM29F800BT-90WBC AM29F800BT-55WBI AM29F800BB-55WBE |
and flexible way to implement power solutions for the latest high performance CPUs and ASICs.; Same as IR3087 with bag packaging
30V Single N-Channel HEXFET Power MOSFET in a I-Pak package; Similar to IRFU3709Z with Lead Free Packaging
40V Single N-Channel HEXFET Power MOSFET in a SO-8 package; Similar to IRF7470 with Lead Free Packaging
Complete VR11.0 or AMD PVID power solution.; A IR3505M packaged on tape and reel 3000 per reel
8 PWM 400 KHz Sync Contr in a 8-Pin SOIC(NB) package; A IRU3037ACS with Standard Packaging
55V Single N-Channel HEXFET Power MOSFET in a D2-Pak package; Similar to IRLZ44NS with Lead Free Packaging
The XPHASE Control IC combined with an IR XPhase TM Phase IC provides a full featured and flexible way to implement a complete an Opteron or Athlon 64 power solution.; A IR3082M with Tape and Reel Packaging
55V Single N-Channel HEXFET Power MOSFET in a SOT-223 package; Similar to IRLL024Z with Lead Free Packaging
55V Single N-Channel HEXFET Power MOSFET in a SOT-223 package; A IRLL2705 with Standard Packaging
75V Single N-Channel HEXFET Power MOSFET in a TO-262 Package; Similar to IRF2807ZL with Lead Free Packaging
55V Single N-Channel HEXFET Power MOSFET in a D2-Pak package; Similar to IRF3805S with Lead Free Packaging
x8/x16 Flash EEPROM x8/x16闪存EEPROM
XPHASE VRD10 Control IC with VccVid and Overtemp Detect; Similar to IR3080M with Lead Free Packaging on Tape and Reel x8/x16闪存EEPROM
XPHASE IC with Fault and Overtemp Detect; Same as the IR3088AM with Tape and Reel Packaging. x8/x16闪存EEPROM
8 Megabit (1 M x 8-Bit/512 K x 16-Bit) CMOS 5.0 Volt-only, Boot Sector Flash Memory 512K X 16 FLASH 5V PROM, 70 ns, PDSO48
8 Megabit (1 M x 8-Bit/512 K x 16-Bit) CMOS 5.0 Volt-only, Boot Sector Flash Memory 512K X 16 FLASH 5V PROM, 70 ns, PDSO44
8 Megabit (1 M x 8-Bit/512 K x 16-Bit) CMOS 5.0 Volt-only, Boot Sector Flash Memory 512K X 16 FLASH 5V PROM, 150 ns, PDSO48
8 Megabit (1 M x 8-Bit/512 K x 16-Bit) CMOS 5.0 Volt-only, Boot Sector Flash Memory 512K X 16 FLASH 5V PROM, 150 ns, PDSO44
|
Linear Technology, Corp.
ATM Electronic, Corp.
Integrated Device Technology, Inc.
Advanced Micro Devices, Inc.
|
