| PART |
Description |
Maker |
| BL817S |
High Density Mounting Type Photocoupler
|
SeCoS
|
| BL817S |
High Density Mounting Type Photocoupler
|
SeCoS Halbleitertechnologie GmbH
|
| PC818 |
High Density Mounting Type Photocoupler
|
Sharp Electrionic Components
|
| PC817B PC817C PC827 PC-817 PC817A PC847 PC837 PC81 |
HIGH DENSITY MOUNTING TYPE PHOTOCOUPLER
|
Sharp Electrionic Compo...
SHARP[Sharp Electrionic Components]
Sharp Corporation
|
| LTV847 LTV817 |
HIgh Density Mounting Type Photocoupler
|
Lite-On Technology Corporation
|
| UDZSTE-175.1B |
Compact, 2-pin mini-mold type for high-density mounting. (UMD2)
|
Rohm
|
| IS452 |
HIGH DENSITY MOUNTING HIGH VOLTAGE DARLINGTON OPTICALLY COUPLED ISOLATORS
|
List of Unclassifed Manufacturers
ISOCOM
|
| HSM88ASR |
MPAK package is suitable for high density surface mounting and high speed assembly
|
TY Semiconductor Co., Ltd
|
| HSU88 |
Ultra small Resin Package (URP) is suitablefor high density surface mounting and high speed assembly
|
TY Semiconductor Co., Ltd
|
| ISP815 ISP815X ISP825 ISP845 ISP845X ISP825X |
HIGH DENSITY MOUNTING PHOTODARLINGTON OPTICALLY COUPLED ISOLATORS
|
ISOCOM[ISOCOM COMPONENTS]
|
