| PART |
Description |
Maker |
| 21-0051 |
PACKAGE OUTLINE, 3L SOT-23
|
Maxim Integrated Products
|
| ATF-53189 |
ATF-53189 · Single Voltage E-pHEMT Low Noise 40 dBm OIP3 in SOT-89 package
Enhancement Mode Pseudomorphic HEMT in SOT 89 Package
|
Agilent (Hewlett-Packard)
Agilent(Hewlett-Packard)
|
| M1MA142WAT1 M1MA141WAT1 ON0325 M1MA141WAT1_D M1MA1 |
SC-70/SOT-323 PACKAGE SINGLE SILICON
SC-70/SOT-323 PACKAGE COMMON ANODE DUAL SWITCHING DIODE 40/80 V-100 mA SURFACE MOUNT
From old datasheet system
|
ON Semiconductor
MOTOROLA[Motorola, Inc]
Motorola Inc
|
| DAN222_D ON0274 DAN222 |
SOT-16/SC-0 PACKAGE COMMON CATHODE
From old datasheet system
SOT-416/SC-90 PACKAGE COMMON CATHODE DUAL SWITCHING DIODE SURFACE MOUNT
|
MOTOROLA INC
ON Semi
Motorola, Inc
|
| SC70-5 |
Surface mounted, 5 pin package Package outline
|
ZETEX[Zetex Semiconductors]
|
| MSA20 |
20-Lead Shrink Small Outline Package (SSOP), EIAJ TYPE II, 5.3mm Wide Package Number MSA20 20 -铅收缩小型封装（SSOP封装），EIAJ型二.3mm宽包MSA20
|
Fairchild Semiconductor, Corp.
Fairchild Semiconductor Corporation
|
| MSOP-10 |
Package Outline
|
Global Mixed-mode Techn...
|
| WLCSP2X2-4 |
Package Outline
|
Global Mixed-mode Techn...
|
| PG-LQFP-64-12 PG-LQFP-64-19 PG-LQFP-64-22 PG-LQFP- |
Package Outline
|
Infineon
|
| WQFN6X6-48 |
Package Outline
|
Global Mixed-mode Techn...
|
| WLCSP11X12-132 |
Package Outline
|
Global Mixed-mode Techn...
|
