| PART |
Description |
Maker |
| 21-0036 |
PACKAGE OUTLINE, 8L UMAX/USOP
|
Maxim Integrated Products
|
| SC70-5 |
Surface mounted, 5 pin package Package outline
|
ZETEX[Zetex Semiconductors]
|
| AP2317GN-HF |
4.2 A, 20 V, 0.052 ohm, P-CHANNEL, Si, POWER, MOSFET HALOGEN FREE AND ROHS COMPLIANT PACKAGE-3
Simple Drive Requirement, Small Package Outline
|
Advanced Power Electronics, Corp.
Advanced Power Electronics Corp.
|
| MSA20 |
20-Lead Shrink Small Outline Package (SSOP), EIAJ TYPE II, 5.3mm Wide Package Number MSA20 20 -铅收缩小型封装（SSOP封装），EIAJ型二.3mm宽包MSA20
|
Fairchild Semiconductor, Corp.
Fairchild Semiconductor Corporation
|
| SOD723 |
Package outline
|
NXP Semiconductors
PHILIPS[Philips Semiconductors]
|
| SOT27-1 |
Package outline
|
NXP Semiconductors
PHILIPS[Philips Semiconductors]
|
| SOT263 |
Package outline
|
NXP
Philips Semiconductors
|
| SSOP-16 |
Package Outline
|
Global Mixed-mode Techn...
|
| WLCSP2X4-8 |
Package Outline
|
Global Mixed-mode Techn...
|
| TDFN3X4-12 |
Package Outline
|
Global Mixed-mode Techn...
|
| TDFN3X4-8 |
Package Outline
|
Global Mixed-mode Techn...
|
| SC70-5 |
Package Outline
|
Global Mixed-mode Techn...
|
