PART |
Description |
Maker |
EBJ21UE8BDS0-AE-F |
256M X 64 MULTI DEVICE DRAM MODULE, DMA204
|
ELPIDA MEMORY INC
|
MP2B5038 MP2B5085 MP2B5052 MP2B5150 |
A multi chip power device for a Multi-Oscillated Current Resonant type Converter
|
Fuji Electric
|
HN7G01FU |
Multi Chip Discrete Device Power Management Switch Application Driver Circuit Application Interface Circuit Application TOSHIBA Multi Chip Discrete Device
|
TOSHIBA[Toshiba Semiconductor]
|
DPS96122-100I DPS96122-85I DPS96122-150I |
256K X 16 MULTI DEVICE SRAM MODULE, 100 ns, DMA68 256K X 16 MULTI DEVICE SRAM MODULE, 85 ns, DMA68 256K X 16 MULTI DEVICE SRAM MODULE, 150 ns, DMA68
|
|
CYM1821PZ-12C CYM1821PM-12C |
16K X 32 MULTI DEVICE SRAM MODULE, 12 ns, ZMA64 16K X 32 MULTI DEVICE SRAM MODULE, 12 ns, SMA64
|
Cypress Semiconductor, Corp.
|
MT2LSYT3272B2G-12L MT4LSYT6472B2G-12L |
32K X 72 MULTI DEVICE SRAM MODULE, 12 ns, DMA160 64K X 72 MULTI DEVICE SRAM MODULE, 12 ns, DMA160
|
RECOM Electronic GmbH
|
SYS32512ZK-010 SYS32512ZK-012 SYS32512ZK-015 SYS32 |
512 K x 32 Static RAM 512K X 32 MULTI DEVICE SRAM MODULE, 12 ns, PZMA72 PLASTIC, ZIP-72 512K X 32 MULTI DEVICE SRAM MODULE, 10 ns, PZMA72 PLASTIC, ZIP-72 512K X 32 MULTI DEVICE SRAM MODULE, 12 ns, PSMA72 PLASTIC, SIMM-72 512K X 32 MULTI DEVICE SRAM MODULE, 10 ns, PSMA72 PLASTIC, SIMM-72 512 K x 32 Static RAM 512亩32静态RAM
|
Amphenol, Corp. MOSAIC http:// Fujitsu, Ltd. NXP Semiconductors N.V.
|
CYM1836V33P8-35C CYM1836V33P8-45C CYM1836V33PM-30C |
512K X 8 MULTI DEVICE SRAM MODULE, 35 ns, PSMA72 512K X 8 MULTI DEVICE SRAM MODULE, 45 ns, PSMA72 512K X 8 MULTI DEVICE SRAM MODULE, 30 ns, SMA64
|
Cypress Semiconductor, Corp. CYPRESS SEMICONDUCTOR CORP
|
CP20251 |
PELTIER MODU LE
|
CUI INC
|
CP40136 |
PELTIER MODU LE
|
CUI INC
|
CP30338 |
PELTIER MODU LE
|
CUI INC
|
CP60133 |
PELTIER MODU LE
|
CUI INC
|