PART |
Description |
Maker |
JYC0128 |
miniature chip type designed for two-way surface mounting
|
IDEA.lnc.
|
IVGC0128 |
miniature chip type designed for surface mounting
|
IDEA.lnc.
|
JYGC0118 |
miniature chip type designed for surface mounting and measure approximately 2.5 x 3 mm
|
IDEA.lnc.
|
IUGC0428 |
miniature lens type designed for surface mounting
|
IDEA.lnc.
|
JYC0175 |
miniature lens type designed for surface mounting
|
IDEA.lnc.
|
JDGC0128 |
right-angle bi-color miniature chip type
|
IDEA.lnc.
|
T77S1D10-24 T75S1D112-05 2-1393222-9 2-1393223-8 |
Sensitive, Low Profile, Hi-Current Relay Designed to Meet International Standards 10 Amp, PC Board Miniature Relay
|
Tyco Electronics
|
S3P7434 S3P7424 S3P7414 S3C7414 S3C7424 S3C7434 |
The S3C7414/C7424/C7434 single-chip CMOS microcontroller has been designed for very high performance using Samsungs newest 4-bit CPU core, SAM47 INDUCTOR HI FREQ 10NH 5% 0201 The S3C7414/C7424/C7434 single-chip CMOS microcontroller has been designed for very high performance using Samsungs newest 4-bit CPU core, SAM47 The S3C7414/C7424/C7434 single-chip CMOS microcontroller has been designed for very high performance using Samsungs newest 4-bit CPU core/ SAM47
|
SAMSUNG SEMICONDUCTOR CO. LTD.
|
S3P7335 S3C7335 |
The S3C7335 single-chip CMOS microcontroller has been designed for high performance using Samsungs newest 4-bit CPU core, SAM47 The S3C7335 single-chip CMOS microcontroller has been designed for high performance using Samsungs newest 4-bit CPU core, SAM47 The S3C7335 single-chip CMOS microcontroller has been designed for high performance using Samsungs newest 4-bit CPU core/ SAM47
|
SAMSUNG SEMICONDUCTOR CO. LTD.
|
C16006 |
Asymmetric IESNA Type I (short) beam designed for tilted poles
|
Ledil, Inc.
|
C16005 |
Asymmetric IESNA Type I (short) beam designed for tilted poles
|
Ledil, Inc.
|