| PART |
Description |
Maker |
| DS-323 DS-323PIN |
Flatpack Three-Way Power Divider 25 - 1000 MHz
|
Tyco Electronics
|
| PIC-MSM-332 |
Flatpack Magnet
|
PIC GmbH
|
| HH-106PIN |
Available in Flatpack and Connectorized Packages
|
M/A-COM Technology Solu...
|
| MS-324-3-1 MS-324-3-2 MS-324-3-3 MS-324-3 |
Miniature Reed Sensor - Flatpack
Miniature Reed Sensor ?Flatpack
|
PIC GmbH
DB Lectro Inc
|
| MD-156PIN MD-156 |
Flatpack Double-Balanced Mixer, 0.6 - 3 GHz
|
Tyco Electronics
|
| MS-324-5-3 MS-324-5-4 MS-324-5-5 MS-324-5 |
Mains switching Reed Sensor - Flatpack
Mains switching Reed Sensor ?Flatpack
|
PIC GmbH
DB Lectro Inc
|
| HH-128-PIN HH-128PIN |
Flatpack Hybrid Junction, 20 - 2000 MHz
|
M/A-COM Technology Solutions, Inc.
|
| MHS2501OFC-3 MHS2501OFH-3 MHS2501OFK-3 |
TRANSISTOR OUTPUT SOLID STATE RELAY, 1000 V ISOLATION-MAX HERMETIC SEALED, FLATPACK-8
|
Microsemi, Corp.
|
| AM24S-3.3-13 AM48S-3.3-13 AM48S-2.5-10 AM48S-15-20 |
7ns, Low Power, Single Supply, Ground-Sensing Comparator; Package: SO; No of Pins: 8; Temperature Range: 0°C to 70°C
90NS, FLATPACK, 883C; LEV B COMPLIANT(EEPROM)
Analog IC
90NS, PLCC, IND TEMP(EEPROM)
70NS, PDIP, COM TEMP(EEPROM) 模拟IC
|
Glenair, Inc.
|
| PUMA67F16000I-25 PUMA67F16000M-15 PUMA67F16000M-20 |
200NS, PGA, 883C; LEV B FULLY COMPLIANT(EEPROM)
250NS, FLATPACK, 883C; LEV B COMPLIANT(EEPROM)
250NS, PGA,883C; LEVEL B FULLY COMPLIANT(EEPROM)
200NS, CERDIP, 883C; LEV B COMPLIANT(EEPROM)
150NS, PDIP, IND TEMP(EEPROM)
150NS, PGA, 883C; LEV B FULLY COMPLIANT(EEPROM)
250NS, FLATPACK, 883C; LEV B COMPLIANT(EEPROM) X32号，闪存EEPROM模块
x32 Flash EEPROM Module X32号，闪存EEPROM模块
|
NXP Semiconductors N.V.
|
| HS-324-R04-0300 |
Flatpack Hall Effect Sensor
|
PIC GmbH
|
