| PART |
Description |
Maker |
| SYC130 NEC256 SHC130 SEC130 SGC130 SRC130 NEC250 S |
LED Displays
Optoelectronic
From old datasheet system
Intel® 82566MC Gigabit Ethernet PHY, Single Port, Pb-Free 2LI, FCBGA, Tray
Box-shaped pin header, Discrete wire crimping connection, Discrete wire connectors; HRS No: 543-0659-0 05; No. of Positions: 18; Connector Type: Wire
(degrees C): -55 to 85; Generic Name: D-SUB; General Description: Receptacle; Right angle; Inch type screw; MIL-C-24308
C): -55 to 85; Generic Name: D-SUB; General Description: Receptacle; Right angle; Locking device with rectangular mating locking base; Through hole
C): -55 to 85; Generic Name: D-SUB; General Description: Receptacle; Right angle; Field-mounting locking device; PCB locking clip; MIL-C-24308
Optoelectronic 光电
|
IDEA
NEC
AME, Inc.
Sanken Electric Co., Ltd.
|
| HT4407 |
General Description
|
TY Semiconductor Co., Ltd
|
| HT3401 |
General Description
|
TY Semiconductor Co., Ltd
TY Semiconductor Co., L...
|
| 8XC251TP 8XC251SP 8XC251TA 8XC251SB 8XC251SQ 8XC25 |
Hardware Description
|
Intel Corporation
|
| KA7307D |
GENERAL DESCRIPTION
|
Samsung semiconductor
|
| I7070 |
General Description
|
Taiwan Memory Technolog...
|
| BT132 |
TRANSISTOR
GENERAL DESCRIPTION
|
TY Semicondutor
TY Semiconductor Co., Ltd
|
| M14C16DD M14C16-DD |
M14C16 Die Description
|
SGS Thomson Microelectronics
STMICROELECTRONICS[STMicroelectronics]
|
| KS7308 |
FCM
GENERAL DESCRIPTION
|
Samsung Electronic
Samsung semiconductor
|
| AOTF42S60L |
PACKAGE MARKING DESCRIPTION
|
Alpha & Omega Semicondu...
|
| TMS27PC512-12DDE TMS27PC512-12DDE4 TMS27PC512-10DU |
PLCC Clip-on Adapters; Top Pin Count: 32; Bottom Pin Count: 32; Part Description: PLCC IC Clip;
Diamond Particle Interconnect GHz MLF/QFN Sockets; Top Pitch (mm): 0.5; IC Size X (mm): 4; IC Size Y (mm): 4; Socket Lid: Swivel; Max Pincount: 20; Part Description: Diamond GHz QFN/MLF Socket (ZIF);
Diamond Particle Interconnect GHz MLF/QFN Sockets; Top Pitch (mm): 0.65; IC Size X (mm): 6; IC Size Y (mm): 6; Socket Lid: Swivel; Max Pincount: 28; Part Description: Diamond GHz QFN/MLF Socket (ZIF);
x8 EPROM x8存储
FPGA Development: XILINX; Top Pin Count: 84; Bottom Pin Count: 84; Top Interface: PLCC SOCKET; Bottom Interface: PLCC PLUG; Device Specific: yes; Devices Supported: XC3020, 3030, 3042; Part Description: Xilinx FPGA adapter; x8存储
|
Maxim Integrated Products, Inc.
Clare, Inc.
TE Connectivity, Ltd.
|
| SGL40N150 SGL40N150TU |
Discrete, IGBT
General Description
|
FAIRCHILD[Fairchild Semiconductor]
|
