| PART |
Description |
Maker |
| TSC607-ZPPACKOF10 TSC506-ZP |
IC FLEX 10KE FPGA 200K 600-BGA
780-pin FineLine BGA BEFESTIGUNGSKLAMMER多珀0ST
|
OSRAM GmbH
|
| QL3025R-2PF144I QL3025R-2PB256C |
FPGA, 672 CLBS, 25000 GATES, 225 MHz, PQFP144
FPGA, 672 CLBS, 25000 GATES, 225 MHz, PBGA256
|
QUICKLOGIC CORP
|
| FGA272-638G FGA303-638G FGAX600-638G FGA304-638G F |
272 POS 1.27MM BGA ADAPTER BGA272, IC SOCKET
303 POS 1.27MM BGA ADAPTER BGA303, IC SOCKET
600 POS 1.27MM BGA EXTRACTION ADAPTER BGA600, IC SOCKET
304 POS 1.27MM BGA ADAPTER BGA304, IC SOCKET
168 POS 1.27MM BGA EXTRACTION ADAPTER BGA168, IC SOCKET
304 POS 1.27MM BGA EXTRACTION ADAPTER
255 POS 1.27MM BGA EXTRACTION ADAPTER
357 POS 1.27MM BGA ADAPTER
560 POS 1.27MM BGA ADAPTER
|
Advanced Interconnections, Corp.
ADVANCED INTERCONNECTIONS CORP
|
| ATS012012017-PF-2P |
12.00 x 12.00 x 17.00 mm BGA Heat Sink (High Aspect Ratio Ext.) Custom Pin Fin
|
Advanced Thermal Solutions, Inc.
|
| ATS060060006-PF-16E |
60.00 x 60.00 x 6.00 mm BGA Heat Sink (High Aspect Ratio Ext.) Custom Pin Fin
|
Advanced Thermal Solutions, Inc.
|
| ATS017017025-PF-5X |
17.00 x 17.00 x 25.00 mm BGA Heat Sink (High Aspect Ratio Ext.) Custom Pin Fin
|
Advanced Thermal Solutions, Inc.
|
| ATS014014014-PF-3M |
14.00 x 14.00 x 14.00 mm BGA Heat Sink (High Aspect Ratio Ext.) Custom Pin FIn
|
Advanced Thermal Solutions, Inc.
|
| ATS012012014-PF-2M |
12.00 x 12.00 x 14.00 mm BGA Heat Sink (High Aspect Ratio Ext.) Custom Pin Fin
|
Advanced Thermal Solutions, Inc.
|
| ATS012012015-PF-2N |
12.00 x 12.00 x 15.00 mm BGA Heat Sink (High Aspect Ratio Ext.) Custom Pin Fin
|
Advanced Thermal Solutions, Inc.
|
| ATS012012018-PF-2Q |
12.00 x 12.00 x 18.00 mm BGA Heat Sink (High Aspect Ratio Ext.) Custom Pin Fin
|
Advanced Thermal Solutions, Inc.
|
| ATS012012024-PF-2W |
12.00 x 12.00 x 24.00 mm BGA Heat Sink (High Aspect Ratio Ext.) Custom Pin Fin
|
Advanced Thermal Solutions, Inc.
|
| ATS012012003-PF-2B |
12.00 x 12.00 x3.00 mm BGA Heat Sink (High Aspect Ratio Ext.) Custom Pin Fin
|
Advanced Thermal Solutions, Inc.
|
