PART |
Description |
Maker |
24C02SC 24C01SC/WF 24C02SC/W08 |
串行EEPROM的| 256X8 |CMOS |晶圆 SERIAL EEPROM|128X8|CMOS|WAFER The 24C02SC is a 2K bit Electrically Erasable PROM with bondpad positions optimized for smart card specific applications. The 24C02SC is organized as a single block of 256 x 8-bit memory with an I2C compatible 2-wire seria
|
Microchip
|
0511030300 51103-0300 |
2.50mm (.098) Pitch Wire-to-Wire and Wire-to-Board Housing, Positive Lock, 3 Circuits
|
Molex Electronics Ltd.
|
5005920600 500592-0600 SD-500592-001 |
2.50mm (.098) Pitch Wire-to-Wire and Wire-to-Board Housing, Positive Lock, 6 Circuits
|
Molex Electronics Ltd.
|
0511110300 51111-0300 |
2.50mm (.098) Pitch Wire-to-Wire and Wire-to-Board Receptacle Housing, WithRetainer, 3 Circuits
|
Molex Electronics Ltd.
|
51111-0310 0511110310 |
2.50mm (.098) Pitch Wire-to-Wire and Wire-to-Board Receptacle Housing, withoutRetainer, 3 Circuits
|
Molex Electronics Ltd.
|
0511111010 |
2.50mm (.098) Pitch Wire-to-Wire and Wire-to-Board Receptacle Housing, withoutRetainer, 10 Circuits
|
Molex Electronics Ltd.
|
51111-0210 |
2.50mm (.098) Pitch Wire-to-Wire and Wire-to-Board Receptacle Housing, withoutRetainer, 2 Circuits
|
Molex Electronics Ltd.
|
51111-0810 0511110810 |
2.50mm (.098) Pitch Wire-to-Wire and Wire-to-Board Receptacle Housing, withoutRetainer, 8 Circuits
|
Molex Electronics Ltd.
|
0510670700 |
3.50mm (.138") Pitch Wire-to-Wire and Wire-to-Board Housing, Positive Lock, 7Circuits
|
Molex Electronics Ltd.
|
0511111200 51111-1200 |
2.50mm (.098) Pitch Wire-to-Wire and Wire-to-Board Receptacle Housing, With Retainer, 12 Circuits
|
Molex Electronics Ltd.
|
51067-1500 |
3.50mm (.138) Pitch Wire-to-Wire and Wire-to-Board Housing, Positive Lock, 15Circuits
|
Molex Electronics Ltd.
|