| PART |
Description |
Maker |
| M39P0R9070E2 M39P0R9070E2ZADE M39P0R9070E2ZADF |
256 or 512Mbit (x16, Multiple Bank, Multi-Level, Burst) Flash memory 128 Mbit Low Power SDRAM, 1.8V supply, Multi-Chip Package
|
Numonyx B.V
|
| M36L0R7050L1ZAMF M36L0R7060U1 M36L0R7060U1ZAME M36 |
128 Mbit (Mux I/O, Multiple Bank, Multi-Level, Burst) Flash memory, 32 or 64 Mbit PSRAM, 1.8V supply Multi-Chip Package
|
STMicroelectronics
|
| M36P0R9060E0 |
Multi-Chip Package
|
ST Microelectronics
|
| A82DL16X4TU |
Stacked Multi-Chip Package
|
AMIC Technology
|
| KAB01D100M-TNGP KAB02D100M-TNGP KAB03D100M-TNGP KA |
Multi-Chip Package MEMORY
|
Samsung Electronic
|
| WEDPS512K32V-XBX WEDPS512K32LV-17BM WEDPS512K32LV- |
512Kx32 SRAM 3.3V MULTI-CHIP PACKAGE
|
WEDC[White Electronic Designs Corporation]
|
| 23-22C-S2BHC-B30-2A |
Reverse Package Chip LED (Multi-Color)
|
Everlight Electronics Co., Ltd
|
| TH50VSF2580AASB TH50VSF2581AASB |
SRAM AND FLASH MEMORY MIXED MULTI-CHIP PACKAGE
|
TOSHIBA[Toshiba Semiconductor]
|
| TH50VSF3680 TH50VSF3681AASB TH50VSF368 |
SRAM AND FLASH MEMORY MIXED MULTI-CHIP PACKAGE
|
TOSHIBA[Toshiba Semiconductor]
|
| AM41PDS3228D |
Stacked Multi-Chip Package (MCP) Flash Memory and SRAM
|
Advanced Micro Devices
|
