| PART |
Description |
Maker |
| LC33832M-70 LC33832P-70 LC33832M-10 LC33832PL-10 L |
Small outline package version of the LC33832SL
x8 Pseudo-Static RAM
|
Sanyo Semiconductor
|
| AP1333GU-HF-14 |
Small Package Outline
|
Advanced Power Electron...
|
| AP2305AGN-HF |
3.2 A, 30 V, 0.06 ohm, P-CHANNEL, Si, POWER, MOSFET HALOGEN FREE AND ROHS COMPLIANT PACKAGE-3
Simple Drive Requirement, Small Package Outline
|
Advanced Power Electronics, Corp.
Advanced Power Electronics Corp.
|
| AP2305BGN-HF AP2305BGN-HF-14 |
4.2 A, 20 V, 0.053 ohm, P-CHANNEL, Si, POWER, MOSFET HALOGEN FREE AND ROHS COMPLIANT PACKAGE-3
Simple Drive Requirement, Small Package Outline
|
Advanced Power Electronics, Corp.
Advanced Power Electronics Corp.
Advanced Power Electron...
|
| AP2321GN-HF AP2321GN-HF14 |
Simple Drive Requirement, Small Package Outline
|
Advanced Power Electronics Corp.
|
| AP2304AGN-HF |
Simple Drive Requirement, Small Package Outline
|
Advanced Power Electronics Corp.
|
| FPT-8P-M02 |
SMALL OUTLINE L-LEADED PACKAGE 8 PIN PLASTIC
|
Fujitsu Component Limited.
Fujitsu Media Devices Limited
|
| AP2301AGN-HF AP2301AGN-HF-14 |
Simple Drive Requirement, Small Package Outline
|
Advanced Power Electronics Corp.
Advanced Power Electron...
|
| AK14D300-HSOP AK14D300-WSO AK08D300-HSOP AK08DS300 |
Small Outline Package SOIC, SOJ and PLCC DIP Adapters
|
ACCUTEK MICROCIRCUIT CORPORATION
ACCUTEK MICROCIRCUIT CORPOR...
ACCUTEK MICROCIRCUIT CO...
|
| SOT765-1 |
plastic very thin shrink small outline package; 8 leads; body width 2.3 mm
|
NXP Semiconductors
PHILIPS[Philips Semiconductors]
|
| MPXV6115V |
High Temperature Accuracy Integrated Silicon Pressure Sensor - Small Outline Package
|
Freescale (Motorola)
|
