| PART |
Description |
Maker |
| NHD-C0216CZ-FSW-FBW-3V3 |
COG (Chip-on-Glass) Liquid Crystal Display Module
|
Newhaven Display Intern...
|
| NHD-C12832A1Z-FSW-FBW-3V3 |
COG (Chip-On-Glass) Liquid Crystal Display Module
|
Newhaven Display International, Inc.
|
| NHD-C0220AU-FSW-FTS |
COG (Chip┸on┸Glass) Liquid Crystal Display Module
|
Newhaven Display Intern...
|
| NHD-C0216CZ-NSW-BBW-3V3 |
COG (Chip-on-Glass) Liquid Crystal Display Module
|
Newhaven Display Intern...
|
| TB-39 |
HIGH FREQUENCY MINIATURE CRY STAL UNITS
|
RSG Electronic Components GmbH
|
| THM401020SG-80 |
Chip-on-Glass (COG) Technology, 16 Characters x 2 Lines 1,048,576 WORDSx40位动态RAM模块
1,048,576 WORDSx40 BIT DYNAMIC RAM MODULE
1/048/576 WORDSx40 BIT DYNAMIC RAM MODULE
|
Toshiba, Corp.
Toshiba Corporation
TOSHIBA[Toshiba Semiconductor]
|
| THM321020S-10 THM321020S-80 THM321020SG-10 THM3210 |
Chip-on-Glass (COG) Technology, 16 Characters x 2 Lines
1048576 WORDS x 32 BIT DYNAMIC RAM MODULE
1,048,576 WORDS x 32 BIT DYNAMIC RAM MODULE
1/048/576 WORDS x 32 BIT DYNAMIC RAM MODULE
|
Toshiba Corporation
TOSHIBA[Toshiba Semiconductor]
|
| THM362020S-10 THM362020S-80 THM362020SG-10 THM3620 |
2097152 WORDS x 36BIT DYNAMIC RAM MODULE
2,097,152 WORDS x 36BIT DYNAMIC RAM MODULE
2/097/152 WORDS x 36BIT DYNAMIC RAM MODULE
Chip-on-Glass (COG) Technology, 16 Characters x 2 Lines
|
TOSHIBA[Toshiba Semiconductor]
Toshiba Corporation
|
| CPD06 |
Chip Form: RECTIFIER CHIP
General Purpose Rectifier 3 Amp Glass Passivated Rectifier Chip
|
Central Semiconductor Corp
|
| CPD05 |
Chip Form: RECTIFIER CHIP
General Purpose Rectifier 1 Amp Glass Passivated Rectifier Chip
|
Central Semiconductor Corp
|
| CPD04 |
Chip Form: RECTIFIER CHIP
General Purpose Rectifier 500 mA Glass Passivated Rectifier Chip
|
Central Semiconductor Corp
|
