PART |
Description |
Maker |
HT1MOA3S30 HT1MOA3S30_E_1 HT1MOA3S30_E_3 |
HITAGTM1 Chip Module
|
NXP Semiconductors
|
25C320E/P 25C320E/SN 25C320E/ST 25C320E/ST14 25LC3 |
Fuses, 750mA 125V F CHIP 1206 32K的SPI总线串行EEPROM Fuses, 2A 125V F CHIP 1206 32K的SPI总线串行EEPROM SENSOR REFLECTIVE OBJECT 50MA 32K的SPI总线串行EEPROM LED 525NM ROUND GREEN 3MM 32K的SPI总线串行EEPROM 32K SPI Bus Serial EEPROM 32K的SPI总线串行EEPROM Fuses, 4A 125V F CHIP 1206 32K的SPI总线串行EEPROM Fuses, 5A 125V F CHIP 1206 IC Socket Test Clip Connector Type:Plunger Type RoHS Compliant: Yes SENSOR PHOTOLOGIC REFLECTIVE Transformers Only Module Connector Adapter; Convert From:Phone Jack; Convert To:Double Banana Plug; Body Material:Brass; Body Style:Straight RoHS Compliant: Yes Fuses, 375mA 125V F CHIP 1206 Binding Post; Current Rating:3A; Body Material:Phosphor Bronze; Color:Black; Voltage Rating:2500V Fuses, 1.25A 125V F CHIP 1206 Fuses, 1A 125V F CHIP 1206 Fuses, 3.5A 125V F CHIP 1206 Filter Module w/out Resistor Network Fuses, 1.5A 125V F CHIP 1206 Fuses, 2.5A 125V F CHIP 1206
|
Microchip Technology, Inc. Microchip Technology Inc.
|
HDG12864F-3 |
128x64 GRAPHICS Chip-On-Glass Parallel interface LCD DISPLAY MODULE 128x64图形芯片玻璃上并行接口液晶显示模 128 x 64 Graphics Chip On Glass LCD Display Module
|
Electronic Theatre Controls, Inc. Hantronix,Inc
|
1792D-16BT0LP 1792D-4B0LP 1792D-2B2LP 1792D-4BT4LP |
MODULE 16 OUT MODULE 4 IN 模块4中的 MODULE 4 IN/4 OUT 模块4输入/ 4输出 MODULE 16 IN 模块16 MODULE 2 IN/2 OUT 模块2输入/ 2输出
|
NXP Semiconductors N.V. Stackpole Electronics, Inc.
|
MC-7884 MC-7884-15 |
GaAs MULTI-CHIP MODULE
|
NEC Quanzhou Jinmei Electro...
|
MC-7896-AZ |
GaAs MULTI-CHIP MODULE
|
NEC
|
B352F110T24 |
VI Chip - BCM Bus Converter Module
|
VICOR[Vicor Corporation]
|
V048K480T006 P048F048M24AL P048F048T24AL P048K048M |
VI Chip - PRM-AL Pre-regulator Module
|
VICOR[Vicor Corporation]
|
V048K030T070 V048F030T070 |
VI Chip - VTM Voltage Transformation Module
|
VICOR[Vicor Corporation]
|
V048F160T015 |
VI Chip - VTM Voltage Transformation Module
|
Vicor Corporation
|