| PART |
Description |
Maker |
| 0015910120 015-91-0120 71308-0112N |
2.54mm (.100) Pitch C-Grid? Header, Surface Mount, Dual Row, Vertical, 12 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating
2.54mm (.100) Pitch C-Grid庐 Header, Surface Mount, Dual Row, Vertical, 12 Circuits, 0.38渭m (15渭) Gold (Au) Selective Plating
MOLEX Connector
|
Molex Electronics Ltd.
|
| 0554012019 |
2.54mm (.100) Pitch QF-50 Flat Ribbon Cable Header, Dual Row, VerticalShrouded Header with Eject Levers, 20 Circuits, Lead-free
MOLEX Connector
|
Molex Electronics Ltd.
|
| 0554011619 55401-1619 |
2.54mm (.100) Pitch QF-50?/a> Flat Ribbon Cable Header, Dual Row, VerticalShrouded Header with Eject Levers, 16 Circuits, Lead-free
2.54mm (.100) Pitch QF-50 Flat Ribbon Cable Header, Dual Row, VerticalShrouded Header with Eject Levers, 16 Circuits, Lead-free
MOLEX Connector
|
Molex Electronics Ltd.
|
| 0015800281 70567-0012 15-80-0281 |
2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 28 Circuits, Tin (Sn) Plating
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 28 Circuits, Tin (Sn) Plating
2.54mm (.100) Pitch C-Grid垄莽 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 28 Circuits, Tin (Sn) Plating
MOLEX Connector
|
Molex Electronics Ltd.
|
| 15-80-0101 70567-0003 A-70567-0003 0015800101 |
2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 10 Circuits, Tin (Sn) Plating
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 10 Circuits, Tin (Sn) Plating
2.54mm (.100) Pitch C-Grid垄莽 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 10 Circuits, Tin (Sn) Plating
Molex Electronics Ltd.
|
Molex Electronics Ltd.
|
| 15-80-0065 0015800065 70567-0137 A-70567-0137 |
2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, 0.76渭m (30渭) Gold (Au) Selective Plati
Molex Electronics Ltd.
|
Molex Electronics Ltd.
|
| 15-80-0083 0015800083 |
2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 8 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 8 Circuits, 0.38渭m (15渭) Gold (Au) Selective Plati
Molex Electronics Ltd.
|
Molex Electronics Ltd.
|
| 0025021014 25-02-1014 A-70204-0326 |
2.54mm (.100") Pitch C-Grid庐 Header, Dual Row, Shrouded, with PC Slot and Guide Ear, 14 Circuits, 0.76渭m (30渭") Gold (Au) Selective Plating
2.54mm (.100) Pitch C-Grid? Header, Dual Row, Shrouded, with PC Slot and Guide Ear, 14 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating
|
Molex Electronics Ltd.
|
| 0025021012 25-02-1012 SDA-70204-0325 |
2.54mm (.100") Pitch C-Grid庐 Header, Dual Row, Shrouded, with PC Slot and Guide Ear, 12 Circuits, 0.76渭m (30渭") Gold (Au) Selective Plating
2.54mm (.100) Pitch C-Grid? Header, Dual Row, Shrouded, with PC Slot and Guide Ear, 12 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating
|
Molex Electronics Ltd.
|
| 0010897300 70280-0095 A-70280-0095 |
2.54mm (.100") Pitch C-Grid庐 Breakaway Header, Dual Row, Vertical, High Temperature, 30 Circuits, 0.76渭m (30渭") Gold (Au) Selective Plating
2.54mm (.100) Pitch C-Grid? Breakaway Header, Dual Row, Vertical, High Temperature, 30 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating
|
Molex Electronics Ltd.
|
|
