| PART |
Description |
Maker |
| TO263 |
Package Outline Drawing Transistor Outline 封装外形图晶体管外形
|
Electronic Theatre Controls, Inc.
ETC
List of Unclassifed Manufacturers
|
| PG12232-E- PG12232-E-33 |
OUTLINE DIMENSION & BLOCK DIAGRAM 外形尺寸
OUTLINE DIMENSION & BLOCK DIAGRAM
|
Powertip Technology, Corp.
Powertip Technology Corp.
POWERTIP[Powertip Technology]
|
| PG12864-A PG12864-AK PG12864-K PG12864-A_K |
OUTLINE DIMENSION & BLOCK DIAGRAM
OUTLINE DIMENSION & BLOCK DIAGRAM
|
POWERTIP[Powertip Technology]
Powertip Technology Corp.
|
| PG12864-O |
OUTLINE DIMENSION & BLOCK DIAGRAM
OUTLINE DIMENSION & BLOCK DIAGRAM
|
POWERTIP[Powertip Technology]
Powertip Technology Corp.
|
| PG160160-B |
OUTLINE DIMENSION & BLOCK DIAGRAM
OUTLINE DIMENSION & BLOCK DIAGRAM
|
Powertip Technology Corp.
POWERTIP[Powertip Technology]
|
| PG320240-E |
OUTLINE DIMENSION & BLOCK DIAGRAM
OUTLINE DIMENSION & BLOCK DIAGRAM
|
Powertip Technology Corp.
POWERTIP[Powertip Technology]
|
| HYM324000GD-60 HYM324000GD-50 |
4M x 32-Bit Dynamic RAM Module SMALL OUTLINE MEMORY MODULE 4M X 32 FAST PAGE DRAM MODULE, 60 ns, ZMA72
CAP 0.5PF 50V /-0.2PF THIN-FILM SN96/AG4/NI 30PPM TR-7-PA
4M x 32 Bit DRAM Module (SO-DIMM)
-4M x 32-Bit Dynamic RAM Module SMALL OUTLINE MEMORY MODULE
|
SIEMENS A G
SIEMENS AG
SIEMENS[Siemens Semiconductor Group]
Infineon
|
| WDFN3X3-10 |
Package Outline
|
Global Mixed-mode Techn...
|
| DFN2X2-10 |
Package Outline
|
Global Mixed-mode Techn...
|
| SC70-4 |
Package Outline
|
Global Mixed-mode Techn...
|
| SOP-8 |
Packaging Outline
|
ETC
List of Unclassifed Manufacturers
|
| SC70-6 |
Package Outline
|
Global Mixed-mode Techn...
|
