PART |
Description |
Maker |
87874-3002 0878743002 |
5.08mm (.200), 2.54mm (.100) Pitch Power, 2.54mm (.100) Pitch Signal, EXTreme PowerPlus Pa-S Header, Through Hole, Right Angle, Screw Mount
|
Molex Electronics Ltd.
|
SD-70287-003 |
2.54mm (.100") Pitch C-Grid庐 Header 2.54mm (.100) Pitch C-Grid? Header
|
Molex Electronics Ltd.
|
SD-70287-004 0702871009 |
2.54mm (.100") Pitch C-Grid庐 Header 2.54mm (.100) Pitch C-Grid? Header
|
Molex Electronics Ltd.
|
70247-1454 0702471454 |
2.54mm (.100") Pitch C-Grid庐 Header 2.54mm (.100) Pitch C-Grid? Header
|
Molex Electronics Ltd.
|
71764-0122 SD-71764-001 |
2.54mm (.100) Pitch C-Grid? Breakaway Header 2.54mm (.100") Pitch C-Grid庐 Breakaway Header
|
Molex Electronics Ltd.
|
71764-0110 SD-71764-001 |
2.54mm (.100) Pitch C-Grid? Breakaway Header 2.54mm (.100") Pitch C-Grid庐 Breakaway Header
|
Molex Electronics Ltd.
|
0022282049 22-28-2049 |
2.54mm (.100) Pitch KK? Header, Breakaway, Right Angle, with Plastic Polarizing Peg, 4 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, with Backwalls Removed 2.54mm (.100) Pitch KK庐 Header, Breakaway, Right Angle, with Plastic Polarizing Peg, 4 Circuits, 0.76渭m (30渭) Gold (Au) Selective Plating, with Backwalls Remove 2.54mm (.100) Pitch KK垄莽 Header, Breakaway, Right Angle, with Plastic Polarizing Peg, 4 Circuits, 0.76楼矛m (30楼矛) Gold (Au) Selective Plating, with Backwalls Rem
|
Molex Electronics Ltd.
|
0022282048 22-28-2048 |
2.54mm (.100) Pitch KK? Header, Breakaway, Right Angle, with Plastic Polarizing Peg, 4 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, with Backwalls Removed 2.54mm (.100) Pitch KK庐 Header, Breakaway, Right Angle, with Plastic Polarizing Peg, 4 Circuits, 0.38渭m (15渭) Gold (Au) Selective Plating, with Backwalls Remove 2.54mm (.100) Pitch KK垄莽 Header, Breakaway, Right Angle, with Plastic Polarizing Peg, 4 Circuits, 0.38楼矛m (15楼矛) Gold (Au) Selective Plating, with Backwalls Rem
|
Molex Electronics Ltd.
|
87914-2815 0879142815 |
2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, 28 Circuits, 0.75μm (30μ) Gold (Au) Plating, Tray Packaging, Lead-free 2.54mm (.100) Pitch C-Grid庐 Header, Through Hole, Dual Row, Vertical, 28 Circuits, 0.75渭m (30渭) Gold (Au) Plating, Tray Packaging, Lead-free 2.54mm (.100) Pitch C-Grid垄莽 Header, Through Hole, Dual Row, Vertical, 28 Circuits, 0.75楼矛m (30楼矛) Gold (Au) Plating, Tray Packaging, Lead-free
|
Molex Electronics Ltd.
|
0022122264 22-12-2264 |
2.54mm (.100) Pitch KK庐 Solid Header, Right Angle, with Friction Lock, 26 Circuits, 0.51渭m (20渭) Gold (Au) Plating 2.54mm (.100) Pitch KK? Solid Header, Right Angle, with Friction Lock, 26 Circuits, 0.51μm (20μ) Gold (Au) Plating
|
Molex Electronics Ltd.
|
0022122114 22-12-2114 A-7478-11A501 |
2.54mm (.100) Pitch KK? Solid Header, Right Angle, with Friction Lock, 11 Circuits, 0.51μm (20μ) Gold (Au) Plating 2.54mm (.100) Pitch KK垄莽 Solid Header, Right Angle, with Friction Lock, 11 Circuits, 0.51楼矛m (20楼矛) Gold (Au) Plating
|
Molex Electronics Ltd.
|
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