| PART |
Description |
Maker |
| C1608X7S2A104KT |
SPECIFICATION FOR TDK MULTILAYER CERAMIC CHIP CAPACITORS
|
TDK Electronics
|
| 2450BL15K050 |
2.45 GHz Medium Performance Balun (Compatible with TDK)
|
Johanson Technology Inc.
|
| GLF2012T220K GLF251812T220M GLC2518T101K GLF2518T1 |
GLF,GLC Series
TDK’s New Winding Type Chip Inductor
|
TDK Electronics
|
| 44A0212 |
This specification sheet forms a part of the latest issue of Raychem Specification 44 and MIL-W-81044 as applicable.
|
Tyco Electronics
|
| 55PC0223 |
This specification sheet forms a part of the latest issue of Raychem Specification 55PC.
|
Tyco Electronics
|
| 55PC0114 |
This specification sheet forms a part of the latest issue of Raychem Specification 55PC.
|
Tyco Electronics
|
| 55PC0812 |
This specification sheet forms a part of the latest issue of Raychem Specification 55PC.
|
TE Connectivity Ltd
|
| CMLT6427E |
ENHANCED SPECIFICATION SURFACE MOUNT, PICOmini SILICON NPN DARLINGTON TRANSISTOR
From old datasheet system
an Enhanced Specification, PICOmini™, NPN Silicon
|
CENTRAL[Central Semiconductor Corp]
Central Semiconductor Corporation
|
| SI4804BDY 72893 SI4804DY |
Dual N-Channel, 30-V (D-S) MOSFET Specification Comparison 双N沟道0 V的（副）MOSFET的规格比
Dual N-Channel/ 30-V (D-S) MOSFET Specification Comparison
|
Vishay Intertechnology, Inc.
Vishay Intertechnology,Inc.
VISAY[Vishay Siliconix]
|
| SPM0204LE5H-QB |
Halogen Free Enhanced RF Protected Zero Height Mini隆卤 SiSonic垄芒 Microphone Specification
Halogen Free Enhanced RF Protected Zero Height Mini SiSonic Microphone Specification
|
Knowles Electronics
|
| MPC755BTXPND MPC755BTXPNS XPC755BRX400TE XPC755BRX |
MPC755 Part Number Specification for the XPC755BxxnnnTx Series
Part Number Specification for the XPC755BxxnnnTx Series
|
Motorola
|
| MPC7451RXSXPND MPC7451RXSXPNS |
MPC7451 Part Number Specification for the XPC7451RXnnnSx Series
Part Number Specification for the XPC7451RXnnnSx Series
|
Motorola
|
