| PART |
Description |
Maker |
| FCRN303 FCRN3031003FA |
Percision thin film resistor CSP
0805 PRECISION THIN FILM RESISTOR CSP (CHIP SCALE PACKAGE)
|
CALMIRCO[California Micro Devices Corp]
|
| M6MGE13VW34DWG-P |
Memory>MCP(Multi Chip Package)>S-CSP(Stacked CSP)
|
Renesas
|
| M6MGD13VW66CWG |
Memory>MCP(Multi Chip Package)>S-CSP(Stacked CSP)
|
Renesas
|
| M6MGB64BS8BWG M6MGT64BS8BWG |
Memory>MCP(Multi Chip Package)>S-CSP(Stacked CSP)
|
Renesas
|
| AN1235 |
FLIP-CHIP CSP: PACKAGE DESCRIPTION AND RECOMMENDATIONS FOR USE
|
SGS Thomson Microelectronics
|
| LHDF-RB10400005000 LHDF-RB10500000000 LHDF-RB10600 |
Chip Scale Package LED
|
Lumileds Lighting Company
|
| CS280 |
Ball Chip Scale Package - CS280
|
XILINX[Xilinx, Inc]
|
| ADF4602BCPZ-RL |
Single-Chip, Multiband 3G Femtocell Transceiver; Package: LFCSP: Leadform Chip Scale; No of Pins: 40; Temperature Range: Ind TELECOM, CELLULAR, RF AND BASEBAND CIRCUIT, QCC40
|
Analog Devices, Inc.
|
| FCSP230LTR |
Chip Scale Package Schottky Barrier Rectifier
|
Vishay Siliconix
|
| FCSP140TR |
Chip Scale Package Schottky Barrier Rectifier
|
Vishay Siliconix
|
| FCSP1H40ETR |
Chip Scale Package Schottky Barrier Rectifier
|
Vishay Siliconix
|
