| PART |
Description |
Maker |
| MK2761ASTR MK2761A MK2761AS MK2761ASLF MK2761ASLFT |
Package Outline and Package Dimensions (16-pin SOIC, 150 Mil. Narrow Body)
|
ICST[Integrated Circuit Systems]
|
| MLPM-6PIN |
Package Dimensions
|
IRF[International Rectifier]
|
| PM1SK1 |
Package Dimensions in mm
|
VISAY[Vishay Siliconix]
|
| 081029132558 |
PACKAGE OUTLINE DIMENSIONS
|
Galaxy Semi-Conductor H...
|
| 081029132758 |
PACKAGE OUTLINE DIMENSIONS
|
Galaxy Semi-Conductor H...
|
| 8DIP300 |
8-DIP-300 Package Dimensions
|
FAIRCHILD[Fairchild Semiconductor]
|
| 369A-13 |
MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS
|
ONSEMI[ON Semiconductor]
|
| 506AL |
MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS
|
ONSEMI[ON Semiconductor]
|
| 528-45AB |
Heat Sink; Package/Case:Half Brick; Body Material:Aluminum; Thermal Resistance:3.2 C/W; Color:Black; Size/Dimensions:0.450H x 2.240W x 2.280L"
|
Wakefield Thermal Solutions
|
| AP02002 |
PACKAGE OUTLINE DIMENSIONS
|
Diodes Incorporated
|
