PART |
Description |
Maker |
7159 7160 7158 |
篓霉隆卤 2 & 3-Cond. Phone Jack, PC Board Mount ??2 & 3-Cond. Phone Jack, PC Board Mount
|
Pomona Electronics
|
6543PA0081000 |
22 AWG BC cond, FEP insul, cond twisted into pairs and individually shielded w/Beldfoil
|
List of Unclassifed Man...
|
DLBM-CG121 |
A Class 2 Bluetooth module suitable for cellular phone, smart phone applications. From old datasheet system
|
Delta ETC[ETC]
|
M7615 |
High noise immunity, Drive either Relay, Adjustable play on duration and latch duration, On-chip voltage regulator, 20 second warm-up., CDS input cond
|
Electronic Theatre Controls, Inc. ETC List of Unclassifed Manufacturers
|
AT76C901 |
Wireless VoIP Phone-based on the 802.11 Standard Processor AT76C901 Summary Wireless VoIP Phone-based on the 802.11 Standard Processor AT76C901 Summary Wireless VoIP Phone based on the 802.11 Standard Processor.
|
ATMEL[ATMEL Corporation]
|
T8301 |
T8301 Internet Protocol Telephone Phone-On-A-Chip?IP Solution DSP T8301 Internet Protocol Telephone Phone-On-A-ChipIP Solution DSP
|
Agere Systems
|
BCM1113R |
IP Phone Chip
|
Broadcom
|
SXG75 |
Mobile Phone
|
Siemens
|
ASJ-119-A |
PHONE JACK
|
Adam Technologies, Inc.
|
IR3N81A |
SPEAKER PHONE IC
|
Sharp Electrionic Components
|
MB82DP02183C-65L MB82DP02183C-65LPBT MB82DP02183C- |
32M Bit (2 M word 16 bit) Mobile Phone Application Specific Memory 2M X 16 STANDARD SRAM, 65 ns, UUC 32M Bit (2 M word 16 bit) Mobile Phone Application Specific Memory 2M X 16 STANDARD SRAM, 65 ns, PBGA71 32M Bit (2 M word × 16 bit) Mobile Phone Application Specific Memory
|
Fujitsu, Ltd. Fujitsu Component Limited.
|