| PART |
Description |
Maker |
| 527249NFP 527249MP 527249BP 527249NFP1 527249NCP1 |
EMI/RFI Shield Sock Backshell with Strain-Relief
|
Glenair, Inc.
|
| 319HT134XM08P 319HT134XM10P 319HT134XM12P 319HT134 |
Composite EMI/RFI Ultra Low-Profile Shield Sock
|
Glenair, Inc.
|
| 447AW711XM08 447AW711XM10 447AW711XM14 447AW711XM1 |
Composite EMI/RFI Banding Backshell with Strain Relief
|
Glenair, Inc.
|
| 447LW330XM08 447LW330XM10 447LW330XM12 447LW330XM1 |
Composite Non-Environmental EMI/RFI Band-in-a-Can Backshell with Qwik-Clamp Strain-Relief
|
Glenair, Inc.
|
| 15-04-0296 15-04-0343 15-04-0340 15-04-0294 |
STRAIN RELIEF 6WAY
STRAIN RELIEF 8WAY
STRAIN RELIEF 2WAY
STRAIN RELIEF 4WAY 应变消除4
|
Molex, Inc.
|
| 2B31 2B30 92F592 |
IC-STRAIN GAUGE CONDITIONER
High Performance, Economy Strain Gage/RTD Conditioners
|
Electronic Theatre Controls, Inc.
ETC[ETC]
Intronics
List of Unclassifed Manufacturers
|
| 74651-1112 |
2.00mm (.079) Pitch 8-Row VHDM-HSD Backplane Header, Guide Pin SignalModule, Shield Pin End Version, Advanced Mate Shield, 60 Circuits
|
Molex Electronics Ltd.
|
| XN04210 XN4210 UN1210 UNR1210 |
Composite Device - Composite Transistors
Silicon NPN epitaxial planer transistor
|
PANASONIC[Panasonic Semiconductor]
|
| 08-810-90 |
IC SOCK 8 PIN VERT GOLD .300 DIP8, IC SOCKET
|
Aries Electronics, Inc.
|
| XN08081 |
Composite Device - Composite Transistors
From old datasheet system
|
Panasonic
|
