| PART |
Description |
Maker |
| IC280-720-106 IC280-256-211 IC280-69605.AC-08327 I |
Ball Grid Array (FBGA / CSP / LGA)
|
Yamaichi Electronics Co., Ltd.
|
| IC264-22501-1 IC264-22501-1-MF IC264-22501-1-NN IC |
Ball Grid Array (BGA, 1.50mm Pitch)
|
Yamaichi Electronics Co., Ltd.
|
| FL9B5BH030S-C FL9B5BH060S-C FL7B5BH FL9B5BH033S-C |
Ball-Grid-Array Thin Film Low-Pass Filter
|
ETC
List of Unclassifed Manufacturers
|
| BGA-320P-M06 |
PLASTIC BALL GRID ARRAY PACKAGE 320 PIN PLASTIC
|
Fujitsu Limited
|
| 3-1640240-4 |
Matrix Series Ball Grid Array ( BGA ) Sockets; 2401 POSITION BGA SOCKET ASSEM ( Tyco Electronics )
|
Tyco Electronics
|
| RFP-20-50TPP-S |
0 MHz - 2000 MHz 50 ohm RF/MICROWAVE TERMINATION ROHS COMPLIANT, CERAMIC PACKAGE-1
Flangeless Termination 20 Watts, 50
|
Anaren, Inc.
Anaren Microwave
|
| 90123-0124 90123-0107 90123-0104 90123-0125 90123- |
Connector Housing; Number of Contacts:24; Pitch Spacing:2.54mm; Number of Rows:1; Series:C-Grid III; Connector Body Material:Polyphenylene Oxide; Contact Termination:Crimp 24 CONTACT(S), FEMALE, TWO PART BOARD CONNECTOR, CRIMP
Connector Housing; No. of Contacts:7; Pitch Spacing:2.54mm; No. of Rows:1; Series:C-Grid III; Connector Body Material:Polyphenylene Oxide; Contact Termination:Crimp RoHS Compliant: Yes 7 CONTACT(S), FEMALE, TWO PART BOARD CONNECTOR, CRIMP
Connector Housing; No. of Contacts:4; Pitch Spacing:2.54mm; No. of Rows:1; Series:C-Grid III; Connector Body Material:Polyphenylene Oxide; Contact Termination:Crimp RoHS Compliant: Yes 4 CONTACT(S), FEMALE, TWO PART BOARD CONNECTOR, CRIMP
C-Grid Modr Crp Hsg SR W/2Pol Bttn 25Ckt 25 CONTACT(S), FEMALE, TWO PART BOARD CONNECTOR, CRIMP
HOUSING, POLARISED 20WAY ; Ways, No. of:20; Approval Bodies:UL, CSA; Current rating:3A; Housing type:Polyphenylene Oxide UL94V-1; Pitch:2.54mm; Resistance, contact:20mR; Resistance, insulation:5000MR; Series:CGRID; Temp, op.
|
Molex, Inc.
MOLEX INC
|
| GCJ21BR71H105MA01 |
Soft Termination Chip Multilayer Ceramic Capacitors for Automotive
|
Murata Manufacturing Co...
|
| GCJ188R71H224KA01 |
Soft Termination Chip Multilayer Ceramic Capacitors for Automotive
|
Murata Manufacturing Co...
|
| CPGA |
Ceramic Pin Grid Array Package
|
Amkor Technology
|
| VS-500-LEF-GNN156.2500 VS-500-LEF-GNN159.3750 VS-5 |
Ceramic Chip Capacitors to MIL-PRF-123; Capacitance: 3pF; Voltage: 100V; Tolerance: ±0.5pF; TC: BP; Chip Size: SMD-1206; Termination: Nickel Guarded, Solder Coated (Sn60)
Ceramic Chip Capacitors to MIL-PRF-123; Capacitance: 3pF; Voltage: 50V; Tolerance: ±0.25pF; TC: BP; Chip Size: SMD-0805; Termination: Nickel Guarded, Solder Coated (Sn60)
Ceramic Chip Capacitors to MIL-PRF-123; Capacitance: 3pF; Voltage: 100V; Tolerance: ±0.25pF; TC: BP; Chip Size: SMD-1206; Termination: Nickel Guarded, Solder Coated (Sn60)
Ceramic Chip Capacitors to MIL-PRF-123; Capacitance: 3pF; Voltage: 100V; Tolerance: ±0.50pF; TC: BP; Chip Size: SMD-0805; Termination: Nickel Guarded, Solder Coated (Sn60)
Voltage Controlled SAW Oscillator 压控SAW振荡
Ceramic Chip Capacitors to MIL-PRF-123; Capacitance: 3pF; Voltage: 100V; Tolerance: ±0.50pF; TC: BP; Chip Size: SMD-0805; Termination: Nickel Guarded, Solder Coated (Sn60) 压控SAW振荡
Ceramic Chip Capacitors to MIL-PRF-123; Capacitance: 3pF; Voltage: 100V; Tolerance: ±0.25pF; TC: BP; Chip Size: SMD-1206; Termination: Nickel Guarded, Solder Coated (Sn60)
|
Vectron International, Inc.
振荡
|
