| PART |
Description |
Maker |
| 19459 19459-3 |
THERMAL INTERFACE PAD (VI-200)
THERMAL INTERFACE PAD, (VI-200)
|
VICOR[Vicor Corporation]
|
| AND8044 AND8044_D AND8044/D |
Single-Channel 1206A ChipFET TM Power MOSFET Recommended Pad Pattern and Thermal Performance
|
ONSEMI
ON Semiconductor
|
| SOT545-3 |
plastic thermal enganced thin quad flat package; 48 leads; body 7 x 7 x 1 mm; exposed die pad
|
NXP Semiconductors
PHILIPS[Philips Semiconductors]
|
| P2NS |
For suggested pad layout, see drawing: PAD-01
|
All Sensors Corporation
|
| ZTACV ZTACV-MX-20.000 ZTTCV-MX-20.000 |
2 Pad and 3 Pad Ceramic Package, 3.1 mm x 3.7 mm
|
ILSI America LLC
|
| 12.000MQ22030-101860 12.000MQ2030-101860 MQ2 MQ203 |
7 x 5mm SMD, 4 pad or 2 pad
|
EUROQUARTZ limited
|
| MP503 |
TMP FEMALE BULKHEAD TO SEMI-RIGID CABLE
|
List of Unclassifed Man...
|
| ZS1031 |
ZS1031 DEVICE SPEC
29LV160BB 2MBYTE FLASH I-TMP 3V TSOP-48
|
PerkinElmer Optoelectro...
PerkinElmer Optoelectronics
PerkinElmer Inc.
|
| FDMF5822DCCT-ND |
FDMF5822DC-Smart Power Stage (SPS) Module with Integrated Thermal Warning and Thermal Shutdown
|
Fairchild Semiconductor
|
| KF2008-GK11A |
Thick Film Thermal Printhead (8dots / mm)
Thermal Printheads > For POS, LABEL > KF200*-GK Series
|
Rohm CO.,LTD.
ROHM[Rohm]
|
| SE2003-DC70A |
High speed thermal printhead (with thermal historical control)
|
ROHM[Rohm]
|
