| PART |
Description |
Maker |
| FCLM830S20RD0 FCLM830S20RD1 FCLM830S20RD2 FCLM830S |
Fiber Coupled Laser Module
|
OPLINK Communications Inc.
OPLINK Communications I...
|
| FCLM375P08LD0 FCLM375P08LD1 FCLM375P08LD2 FCLM375P |
Fiber Coupled Laser Module
|
OPLINK Communications Inc.
|
| G098PU1750M |
High Power Fiber Coupled Infrared Laser Diode
|
Roithner LaserTechnik GmbH
|
| G145PU23W |
High Power Fiber Coupled Infrared Laser Diode
|
Roithner LaserTechnik GmbH
|
| 1060-1100 1050-1150 |
High-Power 10 W 9xx nm Fiber-Coupled Diode Laser
|
JDS Uniphase Corporation
|
| L4-9897603-100B L4-9897603-100C |
High-Power 10 W 976 nm Fiber-Coupled Diode Laser
|
JDS Uniphase Corporation
|
| OL3450L-A-SFMUJ-S2 OL4451L-B-AFMUJ-S1 OL5451L-B-AF |
FIBER OPTIC LASER DIODE MODULE EMITTER, 1300-1320nm, PANEL MOUNT, THROUGH HOLE MOUNT, MU-J CONNECTOR
FIBER OPTIC LASER DIODE MODULE EMITTER, 1480-1500nm, PANEL MOUNT, THROUGH HOLE MOUNT, MU-J CONNECTOR
FIBER OPTIC LASER DIODE MODULE EMITTER, 1510-1530nm, PANEL MOUNT, THROUGH HOLE MOUNT, MU-J CONNECTOR
FIBER OPTIC LASER DIODE MODULE EMITTER, 1620-1640nm, PANEL MOUNT, THROUGH HOLE MOUNT, MU-J CONNECTOR
|
LAPIS SEMICONDUCTOR CO LTD
|
| NDL7603PC NDL7603P NDL7603P1C NDL7603P1D NDL7603P2 |
1 310 nm OPTICAL FIBER COMMUNICATIONS InGaAsP MQW-DFB LASER DIODE COAXIAL MODULE 1 310纳米光纤通信InGaAsP多量子阱激光器激光二极管同轴模块
Opical Fiber Communications Laser Diode(光纤通信激光二极管)
Low Power 5V RS232 Dual Driver/Receiver with 0.1?μF Capacitors; Package: SO; No of Pins: 16; Temperature Range: -40?°C to 85?°C
|
NEC, Corp.
NEC Corp.
NEC[NEC]
|
| SLT4310-QS/RH1 SLT4310-XN |
FIBER OPTIC DFB LASER MODULE EMITTER, 1500-1600nm, PANEL MOUNT, THROUGH HOLE MOUNT, SC/PC CONNECTOR ROHS COMPLIANT PACKAGE
FIBER OPTIC DFB LASER MODULE EMITTER, 1500-1600nm, THROUGH HOLE MOUNT
|
Electronic Theatre Controls, Inc.
|
| OL3204N-40 OL3201N-40 |
FIBER OPTIC LASER DIODE MODULE EMITTER, 1280-1330nm, THROUGH HOLE MOUNT, FC CONNECTOR
1.3 レm High-Power Laser-Diode DIP Module 1.3レ米高功率激光二极管双酯模块
Circular Connector; MIL SPEC:MIL-C-26482, Series I, Solder; Body Material:Aluminum; Series:PT02; Number of Contacts:4; Connector Shell Size:8; Connecting Termination:Solder; Circular Shell Style:Box Mount Receptacle 1.3レ米高功率激光二极管双酯模块
1.3 μm High-Power Laser-Diode DIP Module
1.3 m High-Power Laser-Diode DIP Module
|
LAPIS SEMICONDUCTOR CO LTD
OKI SEMICONDUCTOR CO., LTD.
OKI[OKI electronic componets]
OKI electronic components
|
