PART |
Description |
Maker |
BIR-BO03J4G-1 |
END-LOOK PACKAGE LIGHT EMITTING DIODE
|
BRIGHT LED ELECTRONICS CORP
|
BIR-BM18E4G-2 |
END-LOOK PACKAGE LIGHT EMITTING DIODE
|
Bright LED Electronics Corp.
|
BIR-BM1331 |
END-LOOK PACKAGE LIGHT EMITTING DIODE
|
BRIGHT LED ELECTRONICS CORP
|
BIR-BO13J4G |
5 mm, 1 ELEMENT, INFRARED LED, 850 nm ROHS COMPLIANT PACKAGE-2 END-LOOK PACKAGE LIGHT EMITTING DIODE 17 Bit System Integrating A/D Processor, 16L SOIC 完式组件发光二极
|
American Bright Optoelectronics, Corp. Bright LED Electronics Corp. Bright LED Electronics, Corp.
|
LED55BF LED55CF LED56F |
GAAS INFRARED EMITTIN DIODE 4.67 mm, 1 ELEMENT, INFRARED LED, 940 nm
|
QT[QT Optoelectronics]
|
T7024-TRS T7024 T7024-PGP T7024-PGQ T7024-TRQ |
The T7024 is a monolithic SiGe transmit/receive front-end IC with power amplifier, low-noise amplifier and T/R switch driver. It is especially designed for operation in TDMA systems like Bluetooth and WDCT. BluetoothISM 2.4-GHz Front- End IC Bluetooth?ISM 2.4-GHz Front- End IC Bluetooth⑩/ISM 2.4-GHz Front- End IC Bluetooth/ISM 2.4-GHz Front- End IC
|
Atmel Corp. ATMEL[ATMEL Corporation]
|
BPD-BQD934 |
END- LOOK PACKAGE PIN PHOTO DIODE
|
BRIGHT LED ELECTRONICS CORP
|
SON MICROLEADFRAME DFN |
Saw MLF PEL (Plated End Lead) Package
|
Amkor Technology
|
EHS6B1 EHS6B1-S EHS6Z1 EHS2B1-S EHS12B1-S EHS8B1-S |
Light-to-Digital I2C Sensor; Temperature Range: -40°C to 85°C; Package: 8-DFN 单相 Light-to-Digital Output Sensor with Address Selection, High Sensitivity, Gain Selection, Interrupt Function and I2C Interface; Temperature Range: -40°C to 85°C; Package: 8-ODFN T&R Center Tap 3 Phase Bridge Single Phase Bridge
|
Microsemi, Corp.
|
TEMT6200F |
Ambient Light Sensor in 0805 Package
|
Vishay Siliconix
|
FCW302 |
Package: 3.5*2.8*0.85 mm Applications: Mobile Handset Flash Light
|
Seoul Semiconductor
|
L130-5080001400001 L130-3080001400001 L130-3580001 |
Hot color targeted industry standard package for uniformed light
|
Lumileds Lighting Company
|