| PART |
Description |
Maker |
| SOT926-1 |
plastic thin fine-pitch ball grid array package; 100 balls; body 9 x 9 x 0.7 mm
|
NXP Semiconductors
|
| LFBGA-H FBGA |
Fine Pitch Ball Grid Array
|
STATSCHIP[STATS ChipPAC, Ltd.]
|
| IC264-22501-1 IC264-22501-1-MF IC264-22501-1-NN IC |
Ball Grid Array (BGA, 1.50mm Pitch)
|
Yamaichi Electronics Co., Ltd.
|
| NP396-500 |
Shrink Ball Grid Array (1.27mm Pitch)
|
Yamaichi Electronics Co., Ltd.
|
| NP352-04808 NP352-04811 NP352-04813 NP352-1849-35 |
Fine Ball Grid Array (FBGA, 1.00mm Pitch)
|
Yamaichi Electronics Co., Ltd.
|
| CHC-CH4ALF-01-1002-D-A CHC-CH8ALF-01-1002-D-A CHC- |
Precision Ceramic Ball Grid Arrays
|
IRC - a TT electronics Company.
|
| CB0565A CB0565B |
Ceramic Ball Grid Termination Arrays
|
TT Electronics.
|
| REC-140L |
Precision Linear Transducers, Conductive Plastic, Robust, Double Ball Joints, Designed for Simple, Self-Aligned Mounting, High Accuracy, Excellent Repeatability, Long Life, Essentially Infinite Resolution
|
Vishay
|
| AT24C04Y3-10YI-1.8 AT24C04Y3-10YI-2.7 AT24C04Y1-10 |
SERIAL EEPROM|512X8|CMOS|LLCC|8PIN|PLASTIC
SERIAL EEPROM|1KX8|MOS|LLCC|8PIN|PLASTIC
SERIAL EEPROM|2KX8|CMOS|LLCC|8PIN|PLASTIC
512 X 8 I2C/2-WIRE SERIAL EEPROM, DSO8 6.40 X 3.65 MM, ARRAY PACKAGE, TSSOP-8
128 X 8 I2C/2-WIRE SERIAL EEPROM, DSO8 6.40 X 3.65 MM, ARRAY PACKAGE, TSSOP-8
256 X 8 I2C/2-WIRE SERIAL EEPROM, DSO8 6.40 X 3.65 MM, ARRAY PACKAGE, TSSOP-8
|
Atmel, Corp.
|
| CA-PLCC84-Z-M-T-01 |
Carrier Adapter 84 Position PLCC ZIF Socket with test points to mini-grid array interface.
|
Ironwood Electronics.
|
| 0130-A |
BALL KNOB
|
List of Unclassifed Man...
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