| PART |
Description |
Maker |
| AM70PDL127BDH85I AM70PDL129BDH AM70PDLI27BDH AM70P |
Stacked Multi-Chip Package (MCP/XIP) Flash Memory, Data storage MirrorBit Flash, and pSRAM (XIP)
2 x 64 Megabit (8 M x 16-Bit) CMOS 3.0 Volt-Only Page Mode Flash Memory Data Storage 128 Megabit (8 M x 16-Bit) CMOS
|
SPANSION[SPANSION]
|
| AM70PDL127CDH66IT AM70PDL127CDH85IS AM70PDL127CDH8 |
Stacked Multi-Chip Package (MCP/XIP) Flash Memory, Data storage MirrorBit Flash, and pSRAM (XIP) 堆叠式多芯片封装（MCP / XIP）的快闪记忆体，数据存储的MirrorBit闪存和移动存储芯片（XIP）的
Stacked Multi-Chip Package (MCP/XIP) Flash Memory, Data storage MirrorBit Flash, and pSRAM (XIP) SPECIALTY MEMORY CIRCUIT, PBGA93
2 x 64 Megabit (8 M x 16-Bit) CMOS 3.0 Volt-Only Page Mode Flash Memory Data Storage 128 Megabit (8 M x 16-Bit) CMOS 2 × 64兆位米16位）的CMOS 3.0伏特，只有页面模式闪存数据存28兆位米16位）的CMOS
|
Spansion Inc.
Spansion, Inc.
|
| R5F21336TNFP R5F21334TNXXXFP R5F21334TNFP R5F21334 |
The R8C/33T Group has data flash (1 KB × 4 blocks) with the background operation (BGO)
32-BIT, FLASH, MICROCONTROLLER, PQFP32
RENESAS MCU
|
Renesas Electronics Corporation
http://
|
| P89LPC9321 P89LPC9321FA P89LPC9321FDH P89LPC9321FN |
8-bit microcontroller with accelerated two-clock 80C51 core 8 kB 3 V byte-erasable flash with 512-byte data EEPROM, SOT117-1 (DIP28), Tube 8-BIT, FLASH, 18 MHz, MICROCONTROLLER, PDIP28
|
NXP Semiconductors N.V.
|
| K9F6408QU0C |
8M x 8 Bit NAND Flash Memory Data Sheet
|
Samsung Electronic
|
| MF0060M-03ATXX MF0090M-03ATXX MF0030M-03ATXX MF007 |
8/16-bit Data Bus Flash ATA PC Card
|
Mitsubishi Electric Corporation
|
| K9F3208W0A |
4M x 8Bit NAND Flash Memory Data Sheet
|
Samsung Electronic
|
| K9F5608U0A |
32M x 8 Bit NAND Flash Memory Data sheet
|
Samsung Electronic
|
| MAX7651CCB |
Flash Programmable 12-Bit Integrated Data-Acquisition Systems
|
Maxim Integrated Products, Inc.
|
| MF0512M-07BTXX MF0256M-07BTXX MF0128M-07BTXX MF064 |
256M X 16 FLASH 3.3V PROM CARD, 250 ns, XMA68
8/16-bit Data Bus Flash ATA PC Card 16位产品数据总线闪存阿拉木图PC
Triaxial Cable; Coaxial RG/U Type:59; Impedance:75ohm; Conductor Size AWG:20; No. Strands x Strand Size:Solid; Jacket Material:Foam HDPE; Leaded Process Compatible:Yes RoHS Compliant: Yes
|
Mitsubishi Electric, Corp.
Mitsubishi Electric Corporation
Mitsubishi Electric Semiconductor
|
| MAX7651 MAX7651CCB MAX7651ECB MAX7652CCB MAX7652EC |
Flash Programmable 12-Bit Integrated Data-Acquisition Systems
From old datasheet system
|
MAXIM - Dallas Semiconductor
MAXIM[Maxim Integrated Products]
|
