| PART |
Description |
Maker |
| SLCC |
Leadless Chip Carrier 16-24 Terminal
|
Vishay
|
| CA-QFE52SA-L-Z-T-01 |
Carrier Adaptor (CA) 52 position(0.65mm pitch) QFP Zero Insertion Force socket with test points to leadless surface mount foot.
|
Ironwood Electronics.
|
| PLCC-068-F-A ICF-316-S-O ICF-316-T-O PLCC-044-T-A |
CHIP CARRIER SOCKET PLCC68, IC SOCKET
SURFACE MOUNT DIP SOCKETS DIP16, IC SOCKET
CHIP CARRIER SOCKET PLCC44, IC SOCKET
|
Samtec, Inc.
SAMTEC INC
|
| OP77BRC/883C |
Next Generation OP07, Ultralow Offset Voltage Operational Amplifier; Package: LCC:CER LEADLESS CHIP CARR; No of Pins: 20; Temperature Range: Military OP-AMP, 120 uV OFFSET-MAX, 0.6 MHz BAND WIDTH, CQCC20
|
Analog Devices, Inc.
|
| PMEG3002AEL |
30 V, 0.2 A very low V_F MEGA Schottky barrier rectifier in leadless ultra small SOD882 package 无铅超小型SOD882封装0伏，0.2安很低正向压降MEGA肖特基势垒整流器
30 V, 0.2 A very low VF MEGA Schottky barrier rectifier in leadless ultra small SOD882 package
|
NXP Semiconductors N.V.
http://
|
| MGF1952A |
Microwave Power MES FET (Leadless Ceramic Package)
|
Mitsubishi Electric Semiconductor
|
| NTLTS3107PR2G NTLTS3107P05 NTLTS3107P NTLTS3107P-0 |
Power MOSFET -20 V, -8.3 A, Single P-Channel,Micro8 Leadless Package
|
ONSEMI[ON Semiconductor]
|
| 292D |
Solid Tantalum Chip Capacitors, TANTAMOUNT Leadless Molded
|
Vishay
|
| MGF4851A |
SUPER LOW NOISE InGaAs HEMT (Leadless Ceramic Package)
|
Mitsubishi Electric Semiconductor
|
| MGF4954A MGF4953A |
SUPER LOW NOISE InGaAs HEMT (Leadless Ceramic Package)
|
Mitsubishi Electric Semiconductor
|
