PART |
Description |
Maker |
21-0109B |
PACKAGE OUTLINE, 10L uMAX, EXPOSED PAD
|
Maxim Integrated Products, Inc. MAXIM - Dallas Semiconductor
|
MK2761ASTR MK2761A MK2761AS MK2761ASLF MK2761ASLFT |
Package Outline and Package Dimensions (16-pin SOIC, 150 Mil. Narrow Body)
|
ICST[Integrated Circuit Systems]
|
CJSE115 |
MSOP 8L/10L Amplifier Universal Evaluation PCB (unpopulated) 积极的固定电压稳压器
|
Micron Technology, Inc.
|
AP2311GN-HF AP2311GN-HF-14 |
1.8 A, 60 V, 0.25 ohm, P-CHANNEL, Si, POWER, MOSFET HALOGEN FREE AND ROHS COMPLIANT PACKAGE-3 Simple Drive Requirement, Small Package Outline
|
Advanced Power Electronics, Corp. Advanced Power Electronics Corp. Advanced Power Electronics ...
|
AP2317GN-HF |
4.2 A, 20 V, 0.052 ohm, P-CHANNEL, Si, POWER, MOSFET HALOGEN FREE AND ROHS COMPLIANT PACKAGE-3 Simple Drive Requirement, Small Package Outline
|
Advanced Power Electronics, Corp. Advanced Power Electronics Corp.
|
AP2309AGN-HF |
3.4 A, 30 V, 0.075 ohm, P-CHANNEL, Si, POWER, MOSFET HALOGEN FREE AND ROHS COMPLIANT PACKAGE-3 Simple Drive Requirement, Small Package Outline
|
Advanced Power Electronics, Corp. Advanced Power Electronics Corp.
|
TDFN3X4-12 |
Package Outline
|
Global Mixed-mode Techn...
|
WLCSP2X4-8 |
Package Outline
|
Global Mixed-mode Techn...
|
SOT263 |
Package outline
|
NXP Philips Semiconductors
|
TSSOP-14 |
Package Outline
|
Global Mixed-mode Techn...
|
TSSOP-28-EP |
Package Outline
|
Global Mixed-mode Techn...
|