| PART |
Description |
Maker |
| MDP0040 |
PACKAGE OUTLINE DRAWING QSOP - 0.150 NARROW BODY PACKAGE
|
Elantec Semiconductor
|
| MK2761ASTR MK2761A MK2761AS MK2761ASLF MK2761ASLFT |
Package Outline and Package Dimensions (16-pin SOIC, 150 Mil. Narrow Body)
|
ICST[Integrated Circuit Systems]
|
| SOT-89-3L |
SOT-89-3L PACKAGE OUTLINE DIMENSIONS
SOT-89-3L PACKAGE OUTLINE DIMENSIONS
|
List of Unclassifed Manufacturers
Electronic Theatre Controls, Inc.
|
| SC70-6 |
Surface mounted / 5 pin package Package outline
|
Zetex Semiconductors
|
| AP2305AGN-HF |
3.2 A, 30 V, 0.06 ohm, P-CHANNEL, Si, POWER, MOSFET HALOGEN FREE AND ROHS COMPLIANT PACKAGE-3
Simple Drive Requirement, Small Package Outline
|
Advanced Power Electronics, Corp.
Advanced Power Electronics Corp.
|
| AP2305BGN-HF AP2305BGN-HF-14 |
4.2 A, 20 V, 0.053 ohm, P-CHANNEL, Si, POWER, MOSFET HALOGEN FREE AND ROHS COMPLIANT PACKAGE-3
Simple Drive Requirement, Small Package Outline
|
Advanced Power Electronics, Corp.
Advanced Power Electronics Corp.
Advanced Power Electron...
|
| HD49227FS |
0.3-6.7 V, RAM controller for data/DAT
|
Hitachi Semiconductor
|
| TQFN3X4-20 |
Package Outline
|
Global Mixed-mode Techn...
|
| SOT527-1 |
Package outline
|
NXP Semiconductors
PHILIPS[Philips Semiconductors]
|
| SOT23-5 |
Package Outline
|
Global Mixed-mode Techn...
|
| TSSOP-28-EP |
Package Outline
|
Global Mixed-mode Techn...
|
