| PART |
Description |
Maker |
| MC-7883 |
GaAs MULTI-CHIP MODULE
|
NEC
|
| MC-5951 |
GaAs Multi-Chip Integrated Circuit
|
NEC Electronics
|
| STA8058 |
GPS multi-chip module
|
ST Microelectronics
|
| TH50VPN564 TH50VPN5640EBSB |
MULTI-CHIP INTEGRATED CIRCUIT SILICON GATE CMOS PSEUDO SRAM AND NAND E2PROM MEMORY MIXED MULTI-CHIP PACKAGE
|
TOSHIBA
|
| AT68166F |
Rad Hard 16 MegaBit 3.3V SRAM Multi-Chip Module
|
ATMEL Corporation
|
| AT68166FT-YM25-E AT68166FT-YM25-SCC AT68166FT-YS18 |
Rad Hard 16 MegaBit 3.3V 5V Tolerant SRAM Multi-Chip Module
|
ATMEL Corporation
|
| WEDPNF8M721V-XBX WEDPNF8M721V-1010BC WEDPNF8M721V- |
8Mx72 Synchronous DRAM 8Mb Flash Mixed Module Multi-Chip Package 8Mx72同步DRAM 8MB闪存的混合模块多芯片封装
|
Electronic Theatre Controls, Inc.
List of Unclassifed Manufacturers
|
| CE201210-6N8J CE201210-5N6J CE201210-4N7J CE201210 |
IC,MOT,MC68HC908GR8CP, DIP-28, MCU FLASH 8BIT 8MHZ 4K
IC,MCU,MC68HC908JB8ADW,8-BIT SOIC-28,21 I/O,3MHZ
IC,MCU,MC68HC711E9CFN2,8-BIT 2MHz,PLCC52
8-BIT, OTPROM, 2.1 MHz, MICROCONTROLLER, PDIP20
IC,MCU,MC68HC908KX8CDW,8-BIT SOIC-16,13 I/O,8MHZ
Multi-Layer Chip Inductors 1 ELEMENT, 0.12 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD
Multi-Layer Chip Inductors 1 ELEMENT, 0.0056 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD
Multi-Layer Chip Inductors 1 ELEMENT, 0.33 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD
Multi-Layer Chip Inductors 1 ELEMENT, 0.0027 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD
Multi-Layer Chip Inductors 1 ELEMENT, 0.0068 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD
Multi-Layer Chip Inductors 1 ELEMENT, 0.0082 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD
IC,MCU,MC68HC705C9ACFN,8-BIT PLCC-44,31 I/O,2MHZ 多层片式电感
Multi-Layer Chip Inductors 1 ELEMENT, 0.39 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD
|
Bourns Inc.
Bourns, Inc.
|
| CYM1841APR-20C CYM1841BPZ-25C CYM1841APY-20C CYM18 |
x32 SRAM Module X32号的SRAM模块
256K X 32 MULTI DEVICE SRAM MODULE, 15 ns, PSMA72 PLASTIC, SIMM-72
256K X 32 MULTI DEVICE SRAM MODULE, 35 ns, PSMA72 PLASTIC, SIMM-72
256K X 32 MULTI DEVICE SRAM MODULE, 20 ns, PSMA72 PLASTIC, SIMM-72
256K X 32 MULTI DEVICE SRAM MODULE, 45 ns, PSMA72 PLASTIC, SIMM-72
256K X 32 MULTI DEVICE SRAM MODULE, 45 ns, PSMA64 PLASTIC, SIMM-64
256K X 32 MULTI DEVICE SRAM MODULE, 25 ns, PSMA64 PLASTIC, SIMM-64
256K X 32 MULTI DEVICE SRAM MODULE, 15 ns, PZMA64 PLASTIC, ZIP-64
|
Cypress Semiconductor, Corp.
Everlight Electronics Co., Ltd.
Pyramid Semiconductor, Corp.
YEONHO Electronics Co., Ltd.
|
| WS512K8L-20CM WS512K8L-20CQA WS512K8-XCX WS512K8-2 |
512K X 8 MULTI DEVICE SRAM MODULE, 45 ns, CDIP32
512K X 8 MULTI DEVICE SRAM MODULE, 35 ns, CDIP32
512K X 8 MULTI DEVICE SRAM MODULE, 25 ns, CDIP32
512Kx8 SRAM MODULE, SMD 5962-92078
|
WEDC[White Electronic Designs Corporation]
|
| PQ05R01 PQ05R02 PQ05R03 PQ05R04 PQ09R04 PQ12R02 PQ |
Multi Functional Regulator Module
MULTI-FUNCTIONAL REGULATOR MODULE
RF/Coaxial Connector; RF Coax Type:BNC; Contact Termination:Crimp; Body Style:Right Angle Plug; RG Cable Type:59, 62, 140, 210, Belden 8241, 8263, 8279, 9209 RoHS Compliant: Yes 多功能稳压模
|
Sharp
List of Unclassifed Manufacturers
ETC[ETC]
Electronic Theatre Controls, Inc.
|
| SYS321000LK-012 SYS321000LK-015 SYS321000ZK-015 SY |
1M X 32 MULTI DEVICE SRAM MODULE, 15 ns, PSMA72 PLASTIC, SIMM-72
1M X 32 MULTI DEVICE SRAM MODULE, 15 ns, PZIP72 PLASTIC, ZIP-72
1M X 32 MULTI DEVICE SRAM MODULE, 20 ns, PSMA72 PLASTIC, SIMM-72
1M X 32 MULTI DEVICE SRAM MODULE, 12 ns, PZIP72 PLASTIC, ZIP-72
x32 SRAM Module X32号的SRAM模块
1M X 32 MULTI DEVICE SRAM MODULE, 20 ns, PZIP72 PLASTIC, ZIP-72
|
Sumida, Corp.
TE Connectivity, Ltd.
|
|
