PART |
Description |
Maker |
TH50VSF3582AASB |
MULTI-CHIP INTEGRATED CIRCUIT SILICON GATE CMOS SRAM AND FLASH MEMORY MIXED MULTI-CHIP PACKAGE
|
TOSHIBA
|
5962R0622903VYC AT68166FT-YM25-E AT68166FT-YM25-SC |
512K X 32 STANDARD SRAM, 25 ns, CQFP68 Rad Hard 16 MegaBit 3.3V 5V Tolerant SRAM Multi- Chip Module
|
E2V TECHNOLOGIES PLC ATMEL Corporation
|
WS512K32V-15G2TIA |
512Kx32 SRAM 3.3V MODULE
|
ETC
|
WS512K32NBV-17H2IE WS512K32NBV-15G2CE WS512K32NBV- |
512Kx32 3.3V SRAM MODULE
|
WEDC[White Electronic Designs Corporation]
|
EDI8G32512V |
512Kx32 Static RAM CMOS, High Speed Module(512Kx32 高速CMOS静态RAM模块)
|
White Electronic Designs Corporation
|
MB84VD21181EM-70PBS MB84VD21183EM-70PBS MB84VD2118 |
Stacked MCP (Multi-Chip Package) FLASH MEMORY & SRAM CMOS Stacked MCP (Multi-Chip Package) FLASH MEMORY & SRAM CMOS SPECIALTY MEMORY CIRCUIT, PBGA56
|
Spansion Inc. Spansion, Inc.
|
AT68166F |
Rad Hard 16 MegaBit 3.3V SRAM Multi-Chip Module
|
ATMEL Corporation
|
TH50VSF3680 TH50VSF3681AASB TH50VSF368 |
SRAM AND FLASH MEMORY MIXED MULTI-CHIP PACKAGE
|
TOSHIBA[Toshiba Semiconductor]
|
WF512K32-120G4TQ5A WF512K32-120G4TM5 WF512K32-120G |
EEPROM|FLASH|512KX32|HYBRID|QFL|68PIN|CERAMIC EEPROM|FLASH|512KX32|HYBRID|QFP|68PIN|CERAMIC 的EEPROM | FLASH动画| 512KX32 |混合| QFP封装| 68PIN |陶瓷
|
SMSC, Corp.
|
IDT7010S35FB IDT7010S35L48B IDT7010L25P |
1K X 9 MULTI-PORT SRAM, 35 ns, CQFP48 1K X 9 MULTI-PORT SRAM, 35 ns, CQCC48 1K X 9 MULTI-PORT SRAM, 25 ns, PDIP48
|
INTEGRATED DEVICE TECHNOLOGY INC
|
AM50DL128BH85IS AM50DL128BH85I AM50DL128BH AM50DL1 |
Stacked Multi-Chip Package (MCP) Flash Memory and SRAM
|
AMD[Advanced Micro Devices]
|