| PART |
Description |
Maker |
| AM42DL6404G |
Stacked Multi-Chip Package (MCP) Flash Memory and SRAM
|
Advanced Micro Devices
|
| AM41DL3208GB30IT AM41DL3208GB35IT AM41DL3208GB40IT |
Stacked Multi-Chip Package (MCP) Flash Memory and SRAM
|
Advanced Micro Devices
|
| AM50DL128BG70I AM50DL128BG85I AM50DLI28BG |
Stacked Multi-Chip Package (MCP) Flash Memory and SRAM
|
AMD[Advanced Micro Devices]
|
| AM41DL32X4G |
Stacked Multi-Chip Package (MCP) Flash Memory and SRAM
|
SPANSION
|
| MB84VD2119XEM-70 MB84VD21181EM-70PBS MB84VD21182EM |
Stacked MCP (Multi-Chip Package) FLASH MEMORY & SRAM CMOS
|
SPANSION[SPANSION]
|
| M6MGB64BM17AWG M6MGT64BM17AWG |
Memory>MCP(Multi Chip Package)>S-CSP(Stacked CSP)
|
Renesas
|
| M6MGE13VW66CWG-P |
Memory>MCP(Multi Chip Package)>S-CSP(Stacked CSP)
|
Renesas
|
| M6MGE13VW66CWG |
Memory>MCP(Multi Chip Package)>S-CSP(Stacked CSP)
|
Renesas
|
| DS42516 |
SPECIALTY MEMORY CIRCUIT, PBGA73
Stacked Multi-Chip Package (MCP) Flash Memory and SRAM
|
SPANSION LLC
ADVANCED MICRO DEVICES INC
|
| AM49LV6408MT15I AM49LV4608MT15IS AM49LV4608MT15IT |
Stacked Multi-chip Package (MCP) 64 Mbit (4 M x 16 bit) Flash Memory and 8 Mbit (512K x 16-Bit) 堆叠式多芯片封装（MCP64兆位个M × 16位）闪存兆位（为512k × 16位）
Stacked Multi-chip Package (MCP) 64 Mbit (4 M x 16 bit) Flash Memory and 8 Mbit (512K x 16-Bit) pseudo Static RAM 堆叠式多芯片封装（MCP64兆位个M × 16位）闪存兆位（为512k × 16位）伪静态存储器
Stacked Multi-chip Package (MCP) 64 Mbit (4 M x 16 bit) Flash Memory and 8 Mbit (512K x 16-Bit) pseudo Static RAM 堆叠式多芯片封装（MCP4兆位个M × 16位）闪存兆位（为512k × 16位）伪静态存储器
|
Spansion, Inc.
Spansion Inc.
|
| AM29DL323D |
Stacked Multi-Chip Package (MCP) Flash Memory and SRAM
|
Advanced Micro Devices
|
