| PART |
Description |
Maker |
| BCC BCCS__ BCC_ BCC__ BCCS_ |
Bump Chip Carrier
|
STATSCHIP[STATS ChipPAC, Ltd.]
|
| MA4AGSBP907 |
AlGaAs Solder Bump Flip-Chip PIN Diode
|
M/A-COM Technology Solutions, Inc.
|
| MADS-001317-1320AG |
GaAs Solder Bump Flip Chip Schottky Diode
|
M/A-COM Technology Solutions, Inc.
|
| A-CCS20-G-R A-CCS20-Z-R AE10060 AE10067 AE10054 AE |
CHIP-CARRIER PLCC SOCKET
|
Assmann Electronics Inc.
|
| A-CCS-032-Z-T A-CCS20-G A-CCS28-G |
Chip-Carrier PLCC socket
|
Assmann Electronics Inc...
|
| 2SC5237C |
Voltage Detectors in 4-Bump (2 x 2) Chip-Scale Package 晶体管|晶体管|叩| 250V五（巴西）总裁| 150毫安一（c）|126
|
NEL Frequency Controls, Inc.
|
| 2SC5196O |
Voltage Detectors in 4-Bump (2 x 2) Chip-Scale Package 晶体管|晶体管|叩| 80V的五（巴西）总裁| 6A条一（c）|47VAR
|
Cypress Semiconductor, Corp.
|
| 2SC5090O |
µP Supervisory Circuits in 4-Bump (2 x 2) Chip-Scale Package 晶体管|晶体管|叩| 10V的五（巴西）总裁| 20mA的一（c）|的SC - 70
|
Toshiba, Corp.
|
| J20.BPACKAGE |
20 PAD CERAMIC LEADLESS CHIP CARRIER PACKAGE
|
Intersil Corporation
|
| 2SC5242R 2SC5242 |
TRANSISTOR SILICON NPN TRIPLE DIFFUSED TYPE POWER AMPLIFIER APPLICATIONS
Voltage Detectors in 4-Bump (2 x 2) Chip-Scale Package 晶体管|晶体管| npn型| 230伏五（巴西）总裁|5A一（c）|47VAR
|
Toshiba, Corp.
|
| Z8400AB1 Z8400AB6 Z8400AC1 Z8400AC6 Z8400AD1 Z8400 |
Z80 CPU central processor unit, 6.0 MHz, ceramic chip-carrier package
Z80 CPU Central Process Unit
Z80 CPU central processor unit, 8.0 MHz, ceramic chip-carrier package
|
意法半导
STMICROELECTRONICS[STMicroelectronics]
SGS Thomson Microelectronics
|
