| PART |
Description |
Maker |
| Q67040-A4463 SGW30N60 Q67040-S4237 Q67041-A4713 SG |
IGBTs & DuoPacks - 30A 600V TO247AC IGBT
IGBTs & DuoPacks - 30A 600V TO263AB SMD IGBT
Fast S-IGBT in NPT-Technology
Fast IGBT in NPT-technology
Heat Sink; Package/Case:TO-220; Thermal Resistance:16.7 C/W; Mounting Type:Through Hole; Length:29.97mm; Height:12.7mm; Width:25.4mm; Body Material:Plastic; Color:Black; Leaded Process Compatible:Yes RoHS Compliant: Yes
Heat Sink; Package/Case:TO-220; Thermal Resistance:16.7 C/W; Mounting Type:Through Hole; Length:29.97mm; Height:12.7mm; Width:25.4mm; Body Material:Plastic; Color:Black; Leaded Process Compatible:No RoHS Compliant: No
|
INFINEON[Infineon Technologies AG]
|
| SM6J45A SM6G45 SM6G45A SM6J45 |
BI .DIRECTIONAL TRIODE THYRISTOR SILICON PLANAR TYPE AC POWER CONTROL APPLICATIONS
TOSHIBA BI-DIRECTIONAL TRIODE THYRISTOR SILICON PLANAR TYPE
TO-220 .75H .57W .5D W/MTG TAB
Heat Sink; Package/Case:TO-220; Body Material:Aluminum; Thermal Resistance:27.3 C/W; Color:Black; Leaded Process Compatible:No; Mounting Type:Through Hole; Peak Reflow Compatible (260 C):No; Size/Dimensions:0.750H x 0.500W"
|
TOSHIBA[Toshiba Semiconductor]
Toshiba Corporation
Toshiba, Corp.
|
| SGB06N60 SGD06N60 SGP06N60 Q67040-S4450 SGU06N60 Q |
Heat Sink; Package/Case:TO-220; Thermal Resistance:13.4 C/W; Mounting Type:Through Hole; Length:25.4mm; Height:12.7mm; Width:34.92mm; Body Material:Plastic; Color:Black; Leaded Process Compatible:Yes RoHS Compliant: Yes
Fast IGBT in NPT-technology
IGBTs & DuoPacks - 6A 600V TO263AB SMD IGBT
IGBTs & DuoPacks - 6A 600V TO252AA SMD IGBT
IGBTs & DuoPacks - 6A 600V TO220AB IGBT
|
INFINEON[Infineon Technologies AG]
|
| ATS-55210R-C1-R0 |
High Performance X-CUT - Heat Sink, T412, BLACK-ANODIZED
High Perfomance X-CUT - Heat Sink, T412, BLACK-ANODIZED
|
Advanced Analog Technology, Inc.
Advanced Thermal Solutions, Inc.
|
| ST92F120V1Q7 ST92F120R1Q6 ST92F120JR1Q6 ST92F120JR |
8/16-BIT FLASH MCU FAMILY WITH RAM, EEPROM AND J1850 BLPD
8/16-BIT FLASH MCU FAMILY WITH RAM, EEPROM AND J1850 BLPD
HEATSINK TO-220 VERT MNT W/TABS 16位产品系列闪存微控制器与RAM，EEPROM和J1850 BLPD
Heat Sink; Package/Case:TO-218, TO-247; Thermal Resistance:5 C/W; Mounting Type:Screw Mount; Length:38.1mm; Height:38.1mm; Width:41.91mm; Body Material:Aluminum; Body Plating:Anodized; Color:Black; Leaded Process Compatible:Yes RoHS Compliant: Yes
|
ST Microelectronics
STMicroelectronics N.V.
意法半导
|
| ATS-19G-116-C2-R0 |
Heat Sink Assembly
|
Advanced Thermal Soluti...
|
| C60-075-VE C60-075-AE B60-075-AE B60-075-VE |
Heat Sink System
|
Ohmite Mfg. Co.
|
| NTE424 |
Non-Silicone Heat Sink Compound
|
NTE Electronics, Inc.
|
| XC4028EX-2HQ240C XC4028EX-2HQ304C XC4028EX-2HQ208C |
FPGA, 1024 CLBS, 18000 GATES, 166 MHz, PQFP240 HEAT SINK, QFP-240
FPGA, 1024 CLBS, 18000 GATES, 166 MHz, PQFP304 HEAT SINK, QFP-304
FPGA, 1024 CLBS, 18000 GATES, 166 MHz, PQFP208 HEAT SINK, QFP-208
FPGA, 1296 CLBS, 22000 GATES, 143 MHz, PQFP240
FPGA, 1024 CLBS, 18000 GATES, 166 MHz, CPGA299
FPGA, 1024 CLBS, 15000 GATES, 166 MHz, PQFP304
|
Xilinx, Inc.
XILINX INC
|
| MG1018-16 MG1023-16 MG1008-15 MG1006-11 MG1022-16 |
GUNN Diodes Cathode Heat Sink
|
Microsemi Corporation
http://
|
| LPD70 LPD70-25B LPD70-30B LPD70-20B LPD70-40B LPD7 |
Low Pressure Drop Heat Sink
|
ALPHA
|
| ATS-1144-C1-R0 |
Heat Sink for Half Brick DC-DC Converter
|
Advanced Thermal Soluti...
|
