| PART |
Description |
Maker |
| CMUT5087E CMUT5088E CMUT5087E10 |
ENHANCED SPECIFICATION SURFACE MOUNT COMPLEMENTARY SILICON TRANSISTORS
|
Central Semiconductor Corp
|
| CMPD2836E10 CMPD2838E |
ENHANCED SPECIFICATION SURFACE MOUNT DUAL, SILICON SWITCHING DIODES
|
Central Semiconductor Corp
Central Semiconductor C...
|
| CMUD6263E CMUD6263SE CMUD6263AE CMUD6263CE |
ENHANCED SPECIFICATION SURFACE MOUNT ULTRAmini SILICON SCHOTTKY DIODES
|
CENTRAL[Central Semiconductor Corp]
|
| CMST6427E MST6427E |
ENHANCED SPECIFICATION SURFACE MOUNT, SUPERmini SILICON NPN DARLINGTON TRANSISTOR
|
CENTRAL[Central Semiconductor Corp]
|
| CMPT2222AE |
SMD Small Signal Transistor PNP General Purpose Amplifier/Switch
ENHANCED SPECIFICATION SURFACE MOUNT NPN SILICON TRANSISTOR
|
CENTRAL[Central Semiconductor Corp]
|
| SPM0204LE5H-QB |
Halogen Free Enhanced RF Protected Zero Height Mini隆卤 SiSonic垄芒 Microphone Specification
Halogen Free Enhanced RF Protected Zero Height Mini SiSonic Microphone Specification
|
Knowles Electronics
|
| CMPT3904E10 CMPT3906E CMPT3904E-15 |
ENHANCED SPECIFICATION SURFACE MOUNT COMPLEMENTARY SILICON TRANSISTORS
ENHANCED SPECIFICATION SURFACE MOUNT COMPLEMENTARY SILICON TRANSISTORS
SURFACE MOUNT COMPLEMENTARY SILICON TRANSISTORS
|
Central Semiconductor Corp
Central Semiconductor C...
|
| CZT5551E |
ENHANCED SPECIFICATION SURFACE MOUNT NPN SILICON TRANSISTOR 0.6 A, 220 V, NPN, Si, POWER TRANSISTOR
|
Central Semiconductor, Corp.
|
| SP0208LE5 |
Amplified “Zero Height SiSonic Microphone with Enhanced RF Specification
|
Knowles Electronics
|
| CMPD7000E |
SMD Switching Diode Dual: In Series
ENHANCED SPECIFICATION SURFACE MOUNT DUAL, SILICON SWITCHING DIODE SERIES CONNECTION
|
Central Semiconductor Corp
|
| LSP1004 LSP1011 LSP1000 LSP1012 LSP1002 LSP1004-35 |
35 V, SILICON, PIN DIODE
ENHANCED PERFORMANCE SURFACE MOUNT EPSM PACKAGED DEVICES 增强性能表面贴装绕流封装器件
ENHANCED PERFORMANCE SURFACE MOUNT EPSM PACKAGED DEVICES
|
MICROSEMI CORP-LOWELL
Microsemi, Corp.
MICROSEMI[Microsemi Corporation]
|
| 749010013 744761068A |
All 16 terminals must lie on a plane within 004 of surface A after lead tinning
specification for release
specification for release
|
Wurth Elektronik GmbH & Co. KG, Germany.
Wurth Elektronik GmbH &...
|
