| PART |
Description |
Maker |
| H48-6G |
Thermal Conductive Pad
|
List of Unclassifed Manufacturers
|
| EMW42T EMW42T33-409.60-2.5-30 VEMW42T33-409.60-2.5 |
TCXO, CLOCK, 200.01 MHz, HCMOS OUTPUT
HCMOS 4 pad SMD, W Group
|
EUROQUARTZ LTD
EUROQUARTZ limited
|
| P1BS |
For suggested pad layout, see drawing: PAD-01
|
All Sensors Corporation
|
| LP0002 |
Thermal interface phase change material
|
List of Unclassifed Manufacturers
|
| G751-1P1 G751-2P1 G751-2P8 G75105 G751-2RD |
Digital Temperature Sensor and Thermal Watchdog with Two-Wire Interface
|
Global Mixed-mode Technology Inc.
|
| LM75BIM-3 |
Digital Temperature Sensor and Thermal Watchdog with 2-Wire Interface
|
MAXIM - Dallas Semiconductor
|
| ZTACV ZTACV-MX-20.000 ZTTCV-MX-20.000 |
2 Pad and 3 Pad Ceramic Package, 3.1 mm x 3.7 mm
|
ILSI America LLC
|
| ADT7490ARQZ-REEL7 |
dBCool Remote Thermal Monitor and Fan Controller with PECI Interface
|
ANALOG DEVICES INC
|
| 173-7-220P 173-7-1212P 173-7-240A 173-7-240P 173-9 |
THERMAL COMPOUNDS, ADHESIVES AND INTERFACE MATERIALS
THERMAL COMPOUNDS, ADHESIVES AND INTERFACE MATERIALS
|
List of Unclassifed Manufacturers
List of Unclassifed Manufac...
List of Unclassifed Man...
|
| FF300R12KS4P |
62mm C-Serien Modul mit schnellem IGBT2 für hochfrequentes Schalten und bereits aufgetragenem Thermal Interface Material
|
Infineon Technologies A...
|
| EMC1428-1AP-TR EMC1428-6-AP-TR EMC1428-7-AP-TRCB7 |
1°C Multiple Temperature Sensor with HW Thermal Shutdown & Hottest of Thermal Zones
|
Microchip Technology
|
