| PART |
Description |
Maker |
| H48-2K |
Thermal Conductive Pad on rolls
|
List of Unclassifed Manufacturers
|
| SOT545-3 |
plastic thermal enganced thin quad flat package; 48 leads; body 7 x 7 x 1 mm; exposed die pad
|
NXP Semiconductors
PHILIPS[Philips Semiconductors]
|
| P1BS |
For suggested pad layout, see drawing: PAD-01
|
All Sensors Corporation
|
| LM75BIM-3 LM75BIM-5 LM75BIMX-3 LM75 LM75BIMM-5 LM7 |
Digital Temperature Sensor and Thermal Watchdog with 2-Wire Interface
|
Maxim Integrated Products
http://
|
| 173-7-220P 173-7-1212P 173-7-240A 173-7-240P 173-9 |
THERMAL COMPOUNDS, ADHESIVES AND INTERFACE MATERIALS
THERMAL COMPOUNDS, ADHESIVES AND INTERFACE MATERIALS
|
List of Unclassifed Manufacturers
List of Unclassifed Manufac...
List of Unclassifed Man...
|
| AT77C104B08 AT77C104B-CB08YV AT77C104B-CB09YV AT77 |
FingerChip Thermal Fingerprint Sweep Sensor, Hardware Based, Navigation and Click Function, SPI Interface
|
ATMEL Corporation
http://
|
| FF300R12KS4P |
62mm C-Serien Modul mit schnellem IGBT2 für hochfrequentes Schalten und bereits aufgetragenem Thermal Interface Material
|
Infineon Technologies A...
|
| KD3004-DC70A KD3003-DF10A |
Thick film thermal printhead (with thermal historical control)
Compact high speed thick film thermal printhead (12 dots / mm)
|
ROHM[Rohm]
|
| EMC1428 EMC1428-1-AP EMC1428-6-AP |
1∑C Multiple Temperature Sensor with HW Thermal Shutdown & Hottest of Thermal Zones
|
SMSC Corporation
|
