| PART |
Description |
Maker |
| SSC-STW0Q2PA |
Lead Frame type LED PKG size: 5.6*3.0 thickness 0.9mm
|
Seoul Semiconductor
|
| LT1ET53A |
3.3X2.9mm, 1.1mm Thickness, Milky Diffusion, Dichromatic Chip LED Devices
|
Sharp Electrionic Components
|
| 35408-9202 |
2.28mm (.090) Tab Terminal, 0.30mm (.012) Thickness, 2.0 AVSS, 0.25mm (.010)Thickness, Pre-Tin Plated
|
Molex Electronics Ltd.
|
| 600110 61713 61721 61715 61717 61719 60025 600010 |
ENTLOETLITZE SERIE 60 B 0.9MM L 1.5M
ENTLOETLITZE SERIE 60 B 3.9MM L 1.5M
ENTLOETLITZE SERIE 60 B 1.5MM L 1.5M
ENTLOETLITZE SERIE 60 B 1.9MM L 1.5M
ENTLOETLITZE SERIE 60 B 2.8MM L 1.5M
SODER-WICK SMT NO CLEAN SD 瑟德芯表面贴装免清洗
|
Ametherm, Inc.
|
| DC0000095 |
Messerleiste 9mm SMD, 50 polig Male 9mm SMD, 50 contacts
|
ERNI Electronics
|
| OL6204N-50 OL6204N-50AP OL6204N-50BP OL6204N-BP OL |
From old datasheet system
1.6 um High-Power DIP Module with 9mm Profile
1.6 レm High-Power DIP Module with 9mm Profile
1.6 m High-Power DIP Module with 9mm Profile
1.6 μm High-Power DIP Module with 9mm Profile
Circular Connector; MIL SPEC:MIL-C-26482, Series I, Crimp; Body Material:Aluminum; Series:PT02; No. of Contacts:6; Connector Shell Size:10; Connecting Termination:Crimp; Circular Shell Style:Box Mount Receptacle
|
OKI electronic eomponets
OKI electronic components
OKI[OKI electronic componets]
OKI SEMICONDUCTOR CO., LTD.
|
| OSG50603C1D |
1.6 x 0.8 x 0.45mm SMD
|
OptoSupply International
|
| 16-213-BHC-AN1P2-3T |
0402 Package Chip LED (0.45mm Height)
|
Everlight Electronics Co., Ltd
|
| ATS-60003-C1-R0 |
maxiFLOW Heat Sink, T412, BLUE-ANODIZED, >=45MM COMP
|
Advanced Thermal Solutions, Inc.
|
| CX-91F |
Ultrathin thickness 1.2mm or less. (6.0.7.0mm)
Ultrathin thickness 1.2mm or less. (6.03.71.0mm)
Ultrathin thickness 1.2mm or less. (6.0×3.7×1.0mm)
Ultrathin thickness 1.2mm or less. (6.0】3.7】1.0mm)
SMD
|
KSS[Kyocera Kinseki Corpotation]
American KSS
|
| SKPL-15 |
6.45mm Diameter Low Contact Resistance with Round Terminals (Radial Type)
|
ALPS ELECTRIC CO.,LTD.
|
