| PART |
Description |
Maker |
| STLC2150 |
BLUETOOTH RADIO TRANSCEIVER
|
ST Microelectronics
STMICROELECTRONICS[STMicroelectronics]
|
| NE3002-GV10A |
Thermal Printheads > Fro Plastic Card > NE3002-GV Series
|
ROHM
|
| DFBM-CH120 |
Bluetooth Module Class 2 Wireless communication module compliant with Bluetooth Specification V1.1.
|
DELTA[Delta Electronics, Inc.]
|
| DFBM-CR220 |
Bluetooth Module Class 2 Wireless communication module compliant with Bluetooth Specification V1.2
|
Delta Electronics, Inc.
|
| BCM89071 BCM89071A1CUBXG CYW89071 CYW89071A1CUBXG |
Single-Chip Automotive Grade Bluetooth Transceiver and Baseband Processor
|
Cypress Semiconductor
|
| BCM1200-BT BCM1200-BTEM |
Bluetooth® v1.2 Communication Software for Mobile Phones
BLUETOOTH-R V1.2 COMMUNICATIONS SOFTWARE FOR MOBILE PHONES
BLUETOOTH-R V1.2 COMMUNICATIONS SOFTWARE FOR MOBILE PHONES
|
Broadcom Corporation.
BOARDCOM
|
| FM75 FM75MM8X FM75M8 FM75M8X FM75MM8 |
Low-Voltage Digital I2C compatible Temp Sensor fro LM75 applications
Low Voltage 2-Wire Digital Temperature Sensor with Thermal Alarm
|
Fairchild Semiconductor Corporation
|
| NE2004VA10A A5800562 NE2004-VA10A |
Near edge thin film thermal printhead (8 dots / mm)
From old datasheet system
Near edge thin film thermal printhead (8 dot/mm)
Thermal Printheads > Fro Plastic Card > NE200*-, 300*-VA@ Series
|
Rohm CO.,LTD.
ROHM[Rohm]
|
| PA2423MB-EV PA2423 PA2423MB |
2.4 GHz Bluetooth Class 1 Power Amplifier IC Preliminary Information
2.4 GHz Bluetooth Class 1 Power Amplifier IC Production Information
|
SiGe Semiconductor Inc.
SIGE[SiGe Semiconductor, Inc.]
|
| TB31296FT |
Bluetooth RF IC
|
Toshiba Corporation
Toshiba Semiconductor
|
