| PART |
Description |
Maker |
| MC9S12DP256B MC9S12DP25 |
device made up of standard HCS12 blocks and the HCS12 processor core
MC9S12DP256B Users Guide, Zip Format
|
Freescale Semiconductor, Inc
MOTOROLA
|
| 46012-3241 45750-1211 |
MF PLUS HCS CRIMP TERM MALE 16GA GOLD COPPER ALLOY, GOLD (30) OVER NICKEL FINISH, WIRE TERMINAL
MF PLUS HCS CRIMP TERM. FEM 18-20 GA GLD
|
Molex, Inc.
MOLEX INC
|
| BM-10EG57ND |
hi-eff red chips and green chips, the hi-eff red chips are made from GaAsP on GaP substrate, the green chips are made from GaP on GaP substrate.
5X7 DOT MATRIX DISPLAY, HIGH EFFICIENCY RED/YELLOW GREEN, 30.48 mm
|
BRIGHT LED ELECTRONICS CORP
AMERICAN BRIGHT OPTOELECTRONICS CORP
|
| 44472-0256 44472-1256 |
MiniFit HCS DR Vert V-2 /DH 2Ckt 2 CONTACT(S), MALE, POWER CONNECTOR, SOLDER
MiniFit HCS DR Vert V-2 /DH 12Ckt 12 CONTACT(S), MALE, POWER CONNECTOR, SOLDER
|
Molex, Inc.
|
| 2203163 |
Item is from the HCS product range
|
PHOENIX CONTACT
|
| ARM6-4102 |
Made with UL Approved Materials
|
Allied Components Inter...
|
| 0460152402 0460152003 0460152002 0460152006 |
PRODUCT SPECIFICATION FOR Mini-Fit Plus HCS
|
Molex Electronics Ltd.
|
| L-51P3C |
Made with NPN silicon phototransistor chips
|
ETC
KINGBRIGHT[Kingbright Corporation]
Kingbright Electronic
|
| 1455A1202 1455A1202BK |
Box made from Extruded Aluminum 6063
|
Hammond Manufacturing Ltd.
|
| BA-8Y6UW |
yellow chips, which are made from GaAsP on GaP substrate.
|
BRIGHT LED ELECTRONICS CORP
|
| BD-E323RD |
yellow chips, which are made from GaAsP on GaP substrate.
|
BRIGHT LED ELECTRONICS CORP
|
