PART |
Description |
Maker |
BM-10EG57ND |
hi-eff red chips and green chips, the hi-eff red chips are made from GaAsP on GaP substrate, the green chips are made from GaP on GaP substrate. 5X7 DOT MATRIX DISPLAY, HIGH EFFICIENCY RED/YELLOW GREEN, 30.48 mm
|
BRIGHT LED ELECTRONICS CORP AMERICAN BRIGHT OPTOELECTRONICS CORP
|
PC1482 |
Power Transistor Chips
|
Intersil
|
BM-10EG88MD |
hi-eff red chips and green chips, the hi-eff red chips are made from GaAsP on GaP substrate, the green chips are made from GaP on GaP substrate.
|
BRIGHT LED ELECTRONICS CORP
|
BM-10EG58MD |
hi-eff red chips and green chips, the hi-eff red chips are made from GaAsP on GaP substrate, the green chips are made from GaP on GaP substrate.
|
BRIGHT LED ELECTRONICS CORP
|
CDR04BX104AKUM CDR03BP331B CDR01B151B CDR01BX561B |
CAP 0.15UF 10% X7R SMD-1812 BULK BASE/BARR/SOLDER R-MIL-PRF-55681 CAPACITOR, CERAMIC, MULTILAYER, 50 V, BX, 0.1 uF, SURFACE MOUNT, 1812 Chips MIL-PRF-55681/Chips Part Number Example CDR01 thru CDR06
|
AVX, Corp. AVX Corporation
|
SIDC01D60SIC2SAWN SIDC01D60SIC2UNSAWN |
Diodes - HV Chips - 600V, 4A die sawn Diodes - HV Chips - 600V, 4A die unsawn
|
Infineon
|
GT-6816 |
SCANNER Chips
|
ETC
|
2CW032200JL 2CW032082JL 2CW032510JL 2CW032300JL 2C |
2CW032XXXJL SERIES ZENER DIODE CHIPS FOR PLASTIC PACKAGE 2CW032XXXJL SERIES ZENER DIODE CHIPS FOR PLASTIC PACKAGE
|
Silan Microelectronics ... Silan Microelectronics Joint-stock
|
2CW032750JL |
ZENER DIODE CHIPS
|
Silan Microelectronics
|
SB140-1.3 |
Chips for Schottky Diodes
|
Gunter Seniconductor GmbH.
|
SB320-1.8 SB3100-1.8 SB340-1.8 |
Chips for Schottky Diodes
|
Gunter Seniconductor GmbH.
|
MBR5045 |
Chips for Schottky Diodes
|
Gunter Seniconductor GmbH.
|